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A Study on Film Precursors in SiH4 Thermal CVD by use of Trench Coverage Measurements

Published online by Cambridge University Press:  25 February 2011

Akimasa Yuuki ,
Takaaki Kawahara ,
Yasuji Matsui  and
Kunihide Tachibana
Akimasa Yuuki
Affiliation:
Central Research Laboratory, Mitsubishi Electric Corp., Tsukaguchi Honmachi, Amagasaki, Hyogo 661, Japan
Takaaki Kawahara
Affiliation:
Central Research Laboratory, Mitsubishi Electric Corp., Tsukaguchi Honmachi, Amagasaki, Hyogo 661, Japan
Yasuji Matsui
Affiliation:
Central Research Laboratory, Mitsubishi Electric Corp., Tsukaguchi Honmachi, Amagasaki, Hyogo 661, Japan
Kunihide Tachibana
Affiliation:
Department of Electronics, Kyoto Institute of Technology, Matsugasaki, Sakyo-ku, Kyoto 606, Japan
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Abstract

The precursors of Si film in SiH4 low pressure thermal CVD are studied by use of the trench coverage analysis. The cross sectional profile of the film deposited in a trench is simulated by a direct Monte-Carlo method using the composition of the precursors and their sticking probabilities as adjustable parameters. A comparison with the experimental results[1] shows that the trench coverage profiles are well reproduced by the model where two kinds of precursors deposit independently with respective sticking probabilities of almost zero and unity. The former is silane molecule, and the latter is radicals produced by gas phase reactions. The deposition rate due to radicals can be estimated from the comparison. Considering the sticking probability and the SiH4 pyrolysis reactions, it is concluded that H3SiSiH is one of ate dominant film precursors in gas phase reaction products.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 146: Symposium B – Rapid Thermal Annealing/Chemical Vapor Deposition and Integrated Processing , 1989 , 121
Copyright
Copyright © Materials Research Society 1989

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References

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