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Study of the Hall-Petch Dependence in an Annealed Nanocrystalline Iron Thin Film

Published online by Cambridge University Press:  15 February 2011

J. B. Savader
Affiliation:
The Johns Hopkins University, Department of Materials Science and Engineering, Baltimore, MD 21218, USA
M. R. Scanlon
Affiliation:
The Johns Hopkins University, Department of Materials Science and Engineering, Baltimore, MD 21218, USA Current Address: Rochester Institute of Technology, Rochester, NY 14623, USA
R. C. Cammarata
Affiliation:
The Johns Hopkins University, Department of Materials Science and Engineering, Baltimore, MD 21218, USA
D. T. Smith
Affiliation:
National Institute of Standards and Technology, Ceramics Division, Gaithersburg, MD 20899, USA
C. Hayzelden
Affiliation:
Harvard University, Division of Applied Sciences, Cambridge, MA 02138, USA
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Abstract

The hardness dependence on grain size of a nanocrystalline iron thin film prepared by sputtering was investigated. The as-deposited film had an initial grain size of 11.4 nm and sections of the film were annealed in a reducing atmosphere furnace to increase the grain size up to 31.5 nm. Hardness was measured by nanoindentation for different grain sizes, and a Hall-Petch plot of hardness versus reciprocal square root of grain size was obtained. This Hall-Petch plot gave a positive slope that was about a factor of seven smaller than the slope obtained from ball-milled iron with grain sizes between 6.0 and 8.5 nm [8].

Type
Research Article
Copyright
Copyright © Materials Research Society 1996

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References

1. Christman, T., Scripta Metall. Mater. 28, 1495 (1993).Google Scholar
2. Weertman, J.R., Mater. Sci. Eng. A 166, 161 (1993).Google Scholar
3. Fougere, G.E., Weertman, J.R., Siegel., R.W. and Kim, S., Scripta Metall. Mater. 26, 1879 (1992).Google Scholar
4. Suryanarayana, C., International Materials Reviews 40, 41 (1995).Google Scholar
5. Choksi, A.H., Rosen, A., Karch, J., and Gleiter, H., Scripta Metall. 23, 1679 (1989).Google Scholar
6. McMahon, G. and Erb, U., Microstruct. Sci. 17, 477 (1989).Google Scholar
7. Lu, K., Wei, W.D., and Wang, J.T., Scripta Metall. Mater. 24, 2319 (1990).Google Scholar
8. Jang, J.S.C. and Koch, C.C., Scripta Metall. Mater. 24, 1599 (1990).Google Scholar
9. Christman, T. and Jain, M., Scripta Metall. Mater. 25, 767 (1991).Google Scholar
10. Palumbo, G., Erb, U., and Aust, K.T., Scripta Metall. Mater. 24, 2347 (1990).Google Scholar
11. Höfler, H.J. and Averback, R.S., Scripta Metall. Mater. 24, 240 (1990).Google Scholar
12. Palumbo, G., Thorpe, S.J., and Aust, K.T., Scripta Metall. Mater. 24, 1347 (1990).Google Scholar
13. EI-Serik, A.M., Erb, U., Palumbo, G., and Aust, K.T., Scripta Metall. Mater. 27, 1185 (1992).Google Scholar
14. Nieh, T.G. and Wadsworth, J., Scripta Metall. Mater. 25, 955 (1991).Google Scholar
15. Scattergood, R.O. and Koch, C.C., Scripta Metall. Mater. 27, 1195 (1992).Google Scholar
16. Lian, J., Baudelet, B., and Nazarov, A.A., Mater. Sci. Eng. A172, 23 (1993).Google Scholar
17. Lu, K. and Sui, M.L., Scripta Metall. Mater. 28, 1465 (1993).Google Scholar
18. Warren, B.E., X-ray Diffraction (Dover, New York, 1990) p. 253.Google Scholar
19. Oliver, W.C. and Pharr, G.M., J. Mater. Res. 7, 1564 (1992).Google Scholar
20. Armstrong, R.W., Mat. Res. Soc. Symp. Proc. 362, 9 (1995).Google Scholar
21. Smith, T.R., Armstrong, R.W., Hazzeldine, P.M., Masumura, R.A., and Pande, C.S., Mat. Res. Soc. Symp. Proc. 362, 9 (1995).Google Scholar
22. Savader, J.B., Scanlon, M.R., Cammarata, R.C., Smith, D.T., and Hayzelden, C., submitted to Scripta Metall. Mater.Google Scholar