Hostname: page-component-6bf8c574d5-gr6zb Total loading time: 0 Render date: 2025-02-20T14:43:16.102Z Has data issue: false hasContentIssue false
  • English
  • Français

A Study of the Copper Wire Ball Bonding Processes

Published online by Cambridge University Press:  25 February 2011

Fang Hongyuan ,
Qian Yiyu  and
Jiang Yihong
Fang Hongyuan
Affiliation:
Doctor, Harbin Institute of Technology, Dept. of Welding, Harbin, The People's Republic of China.
Qian Yiyu
Affiliation:
Professor, Harbin Institute of Technology, Dept. of Welding, Harbin, The People's Republic of China.
Jiang Yihong
Affiliation:
Professor, Harbin Institute of Technology, Dept. of Welding, Harbin, The People's Republic of China.
Get access

Abstract

Copper ball bonding is a new technology which is expected to replace the traditional gold ball bonding and paid attention in woled recently, the technology is very important to reduce cost and improve reliability of microelectronic components. In this paper, the copper wire ball bonding processes have been studied by means of the MW-EFO metal wire ball forming device and the JWYH-2 thermosonic ball bonder. The bond strength of the ball bond under varied ultrasonic power and bonding time have been tested. The tested results show that the maximal strength of copper ball bond can be over 20g, it has advantage over the gold wire ball bonding. In this paper, the deformation process of the copper ball bond has been analyzed and viewed by SME.

Keywords

CopperBall bondingBond strength.
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 260: Symposium C – Advanced Metallization and Processing for Semiconductor Devices and Circuits , 1992 , 271
Copyright
Copyright © Materials Research Society 1992

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Hongyuan, F., Electronics Process Technology, No. 10, (1987), (in Chinese).Google Scholar
2. Kurty, J., Proceedings, 34th Electronic Components Conference, IEEE Transactions, PP. 7–12 (1984).Google Scholar
3. Hirote, J., Proceedings, 35th Electronic Components Conference, IEEE Transactions, PP. 116–121 (1985).Google Scholar
4. Astumi, K., Proceedings, 36th Electronic Components Conference, IEEE Transactions, PP. 312–317 (1986).Google Scholar
5. Iongyuan, F., Annual Meeting of the Welding Institution CHES, H-XIX-006–90.Google Scholar