Published online by Cambridge University Press: 28 February 2011
Detailed measurements of the stresses induced by implantation of ions of different types, such as light ions: boron and nitrogen, and heavy ions: argon, krypton and xenon, were carried out in situ on thin silicon films. The measurement were made for keV energy of ions, for a wide range of doses and for different values of the dose rate. Experimental results indicate that the ion-beam-induced transformation in silicon is dose-rate dependent for light ions, as well as for heavy ions. The last conclusion contradicts the classical ideas of amorphization of elemental semiconductors by heavy ions that are based on the concepts of a heterogeneous mechanism of formation of the amorphous state during implantation. Heavy-ion implantation behaves similarly with light-ion implantation at a higher sample temperature. A comparison TEM investigation with stress measurement was made. The results indicate that i) the ion-beam-induced deformation correlates with structural changes and ii) both homogeneous and heterogeneous mechanisms are involved in the structural changes. The results are discussed in terms of non-equilibrium phase transitions in silicon under irradiation.