Hostname: page-component-586b7cd67f-r5fsc Total loading time: 0 Render date: 2024-11-25T15:24:36.322Z Has data issue: false hasContentIssue false

Studies on Curvature Deformation Control of Bilayer Cantilever Fabricated by Surface Micromachining of SOI Wafer

Published online by Cambridge University Press:  26 February 2011

Yu-Ming Huang
Affiliation:
[email protected], Grad. School of Eng. Sci., Osaka Univ., Dept. of Systems Innnovation, 1-3 Machikaneyama-cho, Toyonaka, Osaka, 560-8531, Japan
Masayuki Sohgawa
Affiliation:
[email protected], Grad. School of Eng. Sci., Osaka Univ., Dept. of Systems Innnovation, 1-3 Machikaneyama-cho, Toyonaka, Osaka, 560-8531, Japan
Minoru Noda
Affiliation:
[email protected], Grad. School of Eng. Sci., Osaka Univ., Dept. of Systems Innnovation, 1-3 Machikaneyama-cho, Toyonaka, Osaka, 560-8531, Japan
Kaoru Yamashita
Affiliation:
[email protected], Grad. School of Eng. Sci., Osaka Univ., Dept. of Systems Innnovation, 1-3 Machikaneyama-cho, Toyonaka, Osaka, 560-8531, Japan
Masanori Okuyama
Affiliation:
[email protected], Grad. School of Eng. Sci., Osaka Univ., Dept. of Systems Innnovation, 1-3 Machikaneyama-cho, Toyonaka, Osaka, 560-8531, Japan
Haruo Noma
Affiliation:
[email protected], ATR, Knowledge Science Lab., 2-2-2- Hikari-dai, Seika, Souraku, Kyoto, 619-0288Japan
Get access

Abstract

The Cr/Si bilayer cantilevers for an integrated multi-axis tactile sensor were fabricated by Si surface micromachining process. Among the cantilevers with various shapes, the rectangular and semicircular cantilevers can be deflected upward with good controllability. The maximum deflections are compared with those calculated by finite element method. Calculated deflections of Cr/Si cantilever agree considerably with the measured one. So, it is considered that the analysis by finite element method is useful as optimization of layer thickness and size to obtain the Cr/Si bilayer cantilevers with accurate deflection.

Type
Research Article
Copyright
Copyright © Materials Research Society 2007

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1. Hou, M. T. and Chen, R., J. Micromech. Microeng. 13, 141 (2003)Google Scholar
2. Hou, M. T. and Chen, R., J. Micromech. Microeng. 14, 490 (2004).Google Scholar
3. Linnemann, R., Gotszalk, T., Hadjiiski, L. and Rangelow, I. W., Thin Solid Films 264, 159 (1995).Google Scholar
4. Kolesar, E. S., Allen, P. B., Howard, J. T., Wilken, J. M. and Boydston, N., Thin Solid Films 355–356, 295 (1999).Google Scholar
5. Hamaguchi, H., Sugano, K., Tsuchiya, T. and Tabata, O., Proc. of 23rd Sensor Symposium, 471 (2006).Google Scholar
6. Chatzandroulis, S., Tserepi, A., Goustouridis, D., Normand, P., and Tsoukalas, D., Microelectro. Eng. 61–62, 955 (2002).Google Scholar
7. Takagaki, T., Sun, Y. J., Brandt, O. and Ploog, K. H., App. Phys. Lett. 84, 4756 (2004).Google Scholar
8. Noda, K., Hoshino, K., Matsumoto, K. and Shimoyama, I., 18th IEEE Int. conf. on Micro Electro Mechanical Systems, Miami, Florida, USA, 283 (January–February 2005).Google Scholar
9. Yoshida, S., Mizota, K. and Noma, H., Virtual Reality Society of Japan 11th Annual Conf., Sendai, Japan (September 2006).Google Scholar
10. Sohgawa, M., Noda, M., Huang, Y. M., Yamashita, K., Kanashima, T., Okuyama, M. and Noma, H., Proc. of 23rd Sensor Symposium, 165 (2006).Google Scholar
11.Rika Nenpyo”, edited by National Astronomical Observatory of Japan (Maruzen, 2000).Google Scholar
12. Petersen, K. E. and Guarnieri, C. R., J. Appl. Phys. 50, 6761 (2006).Google Scholar
13. Kim, J., Varadan, V. V. and Varadan, V. K., Int. J. Numer. Methods Eng. 40, 817 (1997).Google Scholar