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Stresses in Adhesively Bonded Bi-Material Assemblies Used in Electronic Packaging

Published online by Cambridge University Press:  25 February 2011

E. Suhir
E. Suhir*
Affiliation:
AT&T Bell Laboratories, 600 Mountain Avenue, Murray Hill, NJ 07974
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Abstract

The magnitude and the distribution of stresses in elongated adhesively bonded bi-material assemblies subjected to uniform heating or cooling are determined and discussed. The suggested approach enables one to evaluate the stresses in the assembly components themselves, as well as the shearing and normal (peeling) stresses in the interface, with consideration of the attachment compliance. The case of an epoxy bonded assembly is used to illustrate the developed theory.

Type
Articles
Information
MRS Online Proceedings Library (OPL) , Volume 72: Symposium G – Electronic Packaging Materials Science II , 1986 , 133
Copyright
Copyright © Materials Research Society 1986

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References

1. Timoshenko, S. P., “Analysis of bi-metal thermostats,” Journal of the Optical Society of America, vol.11, Sept. 1925.CrossRefGoogle Scholar
2. Glascock, H. H. and Webster, H. J., ”Structural copper: a pliable high conductance material for bonding to silicon power devices,” IEEE Transactions on Components, Hybrids, and Manufacturing Technology, vol. CHMT–6, No. 4, Dec. 1984.Google Scholar