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Stress Simulation in Area Array Packaging

Published online by Cambridge University Press:  10 February 2011

Steven Groothuis
Affiliation:
Texas Instruments, Incorporated,Mail Station 477,13532 North Central Expressway,Dallas, TX 75243, (972) 995–2268, E‐mail: [email protected]
Nick Hassanzadeh
Affiliation:
Texas Instruments, Incorporated,Mail Station 477,13532 North Central Expressway,Dallas, TX 75243, (972) 995–2268, E‐mail: [email protected]
Les Stark
Affiliation:
Texas Instruments, Incorporated,Mail Station 477,13532 North Central Expressway,Dallas, TX 75243, (972) 995–2268, E‐mail: [email protected]
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Abstract

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Type
Research Article
Copyright
Copyright © Materials Research Society 1997

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References

Baba, S., et al. “Molded Chip Scale Package for High Pin Count,” Proc. 46th IEEE Electronic Components and Technology Conference. 1996, pp.12511257.Google Scholar
Clech, J.‐P., et al. , “A Comprehensive Surface Mount Reliability (CSMR) Model Covering Several Generations of Assembly Technology,” Proc. 43rd IEEE Electronic Components and Technology Conference. 1993, pp. 6270.Google Scholar
Clech, J.‐P., et al. , “Surface Mount Assembly Failure Statistics and Failure Free Times,” Proc. 44th IEEE Electronic Components and Technology Conference, 1994.Google Scholar
Darveaux, R., “Crack Initiation and Growth in the Surface Mount Solder Joints,” International Society of Hybrid Microelectronics Proceedings 1993, pp. 8697.Google Scholar
Di Giacomo, G. “Effect of Mini‐cycles on the Solder Joints Fatigue Behavior as a Result of their Superimposition on Main Cycles,” International Society of Hybrid Microelectronics Proceedings. 1996, pp. 302307.Google Scholar
Groothuis, S., and Heinen, K.G., “Mold Compounds : Linking Material Science and IC Package Reliability,” Materials Research Society Proc. (Electronic Packaging Materials Science VIII). Vol. 390, 1995, pp. 7788.Google Scholar
Hertzberg, R.W. Deformation and Fracture Mechanics of Engineering Materials. 3rd ed., New York. Wiley & Sons, 1989.Google Scholar
Iannuzzelli, R., et al. “Application of Integrated Matrix Creep of Solder Joint Reliability Prediction,” 1995 ASME Congress & Exposition Publication 95‐WA/EEP‐2. 1995, pp. 116.Google Scholar
Jones, W.K., et al. “The At‐Temperature Mechanical Properties of Lead‐Tin Based Alloys,”, “International Society of Hybrid Microelectronics Proceedings 1996, pp. 322327.Google Scholar
Lau, J.H., ‘Thermal Fatigue Life Prediction of Flip Chip Solder Joints by Fracture Mechanics Method,” International Journal of Engineering Fracture Mechanics 1993, pp.642654.Google Scholar
Karnezos, M., et al. “Flex Tape Ball Grid Array,” Proc. 46th IEEE Electronic Components and Technology Conference 1996, pp.12711277.Google Scholar
Katchmar, R., et al. “Factors Influencing Fatigue Life of Area‐Array Solder Joints,”, “International Society of Hybrid Microelectronics Proceedings 1996, pp. 551556.Google Scholar
Mawer, A., and Darveaux, R. “Calculation of Thermal Cycling and Application Fatigue Life of Plastic Ball Grid Array (PBGA) Package,” Proc. International Electronic Packaging Society Proceedings, 1993.Google Scholar
Subrahmanyan, R., “A Damage Integral Approach for Low‐Cycle Isothermal and Thermal Fatigue,” Ph.D. thesis, Cornell University, 1990.Google Scholar
Winter, P.R. and Wallach, E.R. “Microstructural Modelling and Electronic Interconnect Reliability,” International Society of Hybrid Microelectronics Proceedings. 1996, pp. 3439.Google Scholar