Hostname: page-component-586b7cd67f-dlnhk Total loading time: 0 Render date: 2024-11-25T17:23:33.601Z Has data issue: false hasContentIssue false
  • English
  • Français

Stress, Mechanical Properties and Composition Measurements in Sputtered Thick Alumina Films

Published online by Cambridge University Press:  15 February 2011

C. A. Ross  and
J. J. Barrese
C. A. Ross
Affiliation:
Komag Inc., 275 S. Hillview Drive, Milpitas, CA 95035
J. J. Barrese
Affiliation:
Department of Materials Science and Engineering, Stanford University, Stanford CA 94305
Get access

Abstract

Thick r.f.-sputtered alumina is used as an overcoat material in microelectronic applications. The stress in the material is compressive and its magnitude is influenced by the sputtering conditions including the power, gas pressure and r.f. substrate bias. These parameters also affect the deposition rate, stoichiometry and sputter gas (argon) content of the material and its etch rate in hydroxide solutions. Nanoindentation measurements of the elastic modulus and hardness are presented for alumina sputtered under different bias conditions and show that the zero bias material appears to be harder and suffer than material deposited at -100V bias.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 308: Symposium M1 – Thin Films: Stresses and Mechanical Properties IV , 1993 , 595
Copyright
Copyright © Materials Research Society 1993

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1 Kennedy, T. N., Electron. Packaging Prod. 14 136 (1974)Google Scholar
2 Gardner, R. A., Peterson, P. J. and Kennedy, T. N., J. Vac. Sci. Technol. 14 (5) 1139 (1977)Google Scholar
3 Nowicki, R. S., J. Vac. Sci. Technol. 14 (1) 127 (1977)Google Scholar
4 Kennedy, T. N., J. Vac. Sci. Technol. 13 (6) 1135 (1976)Google Scholar
5 Doerner, M.F. and Nix, W.D., J. Mater. Res. 1 (4) 601 (1986)Google Scholar
6 Oliver, W.C. and Pharr, G.M., J. Mater. Res. 7 (6) 1564 (1992)Google Scholar
7 Thornton, J.A., J. Vac. Sci. Technol. A 4 (6) 3059 (1986)Google Scholar
8 Bland, R.D., Kominiak, G.J. and Mattox, D.M., J. Vac. Sci. Technol., 11 (4) 671 (1994)Google Scholar
9 Knoll, R.W. and Bradley, E.R., Thin solid films 117 201 (1984)Google Scholar
10 Chou, T. C., Nieh, T.G., McAdams, S.D. and Pharr, G.M., Scripta Met. et Mat. 25 (10) 2203 (1991)Google Scholar
11 Chang, C., Neubauer, G., Sauter Mack, A., Yoshioka, K., Cuan, G., Flinn, P.A. and Fraser, D.B., Proc. Mater. Res. Soc. 264 (1992)Google Scholar