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Stress and Strength of free-standing 2-dimensional tetrahedral amorphous carbon bridge arrays

Published online by Cambridge University Press:  01 February 2011

Daniel H.C. Chua ,
T. H. Tsai ,
W. I. Milne ,
D. Sheeja  and
B. K. Tay
Daniel H.C. Chua
Affiliation:
Engineering Dept, University of Cambridge, Trumpington Street, Cambridge, CB2 1PZ, England
T. H. Tsai
Affiliation:
Engineering Dept, University of Cambridge, Trumpington Street, Cambridge, CB2 1PZ, England
W. I. Milne
Affiliation:
Engineering Dept, University of Cambridge, Trumpington Street, Cambridge, CB2 1PZ, England
D. Sheeja
Affiliation:
School of Electrical and Electronics Engineering, Nanyang Technological University, Singapore
B. K. Tay
Affiliation:
School of Electrical and Electronics Engineering, Nanyang Technological University, Singapore
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Abstract

The fabrication of ultrathin (25nm) 2-dimensional free-standing arrays of tetrahedral amorphous Carbon (ta-C) microbridges is reported for the first time. The ta-C films were deposited by a Filtered Cathodic Vacuum Arc (FCVA) deposition system where the sp3 content in the film was measured to be in excess of 90% by high resolution XPS. Continuous arrays of free standing taC bridges whose length/width ratios ranged from 1:1 to 12:1 were successfully fabricated while maintaining the same thickness. Due to the naturally high compressive stress of ta-C films, the buckling of films was perpendicular to the length of the beam. The displacement of curvature obtained was in good agreement with FEM simulation results. Moreover, the curvature or arch of these ultrathin films, coupled with a high Young's modulus (750GPa) and Hardness (60GPa), meant they could withstand a vertical force in excess of 8000μN without breaking.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 795: Symposium U – Thin Films - Stresses and Mechanical Properties X , 2003 , U8.27
Copyright
Copyright © Materials Research Society 2004

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References

REFERENCES

1. Cleland, A.N. and Roukes, M.L., Appl. Phys. Lett. 69 (1996) 2653 Google Scholar
2. Erbe, A., Blick, R.H., Tilke, A., Kriele, A. and Kotthaus, J.P., Appl. Phys. Lett. 73 (1998) 3751 Google Scholar
3. Ilic, B., Czaplewski, D., Zalalutdinov, M., Craighead, H.G., Neuzil, P., Campagnolo, C., and Batt, C., J. Vac. Sci. Technol. B 19 (2001) 2825 Google Scholar
4. Mamin, H.J. and Rugar, D., Appl. Phys. Lett. 79 (2001) 3358 Google Scholar
5. Fallon, P.J., Veerasamy, V.S., Davis, C.A., Robertson, J., Amaratunga, G.A.J., Milne, W.I., Koskinen, J., Phys. Rev. B 48 (1993) 4777 Google Scholar
6. Shi, X., Tay, B.K., Tan, H.S., Zhong, L., Tu, Y.Q., Silva, S.R.P. and Milne, W.I., J. Appl. Phys. 79 (1996) 7239 Google Scholar
7. Teo, K.B.K, Rodil, S.E., Tsai, J.T.H., Ferrari, A.C., Robertson, J., Milne, W.I., J. Appl. Phys. 89 (2001) 3706 Google Scholar
8. Stoney, G.G., Proc. R. Soc. London 82 (1909) 172 Google Scholar
9. Fang, W. and Wickert, J.A., Micromech, J.. Microeng. 4 (1994) 116 Google Scholar
10. Fang, W., Lee, C.H. and Hu, H.H., Micromech, J.. Microeng 9 (1999) 236 Google Scholar
11. Haji-Babaei, J., Kwow, C.Y. and Huang, R.S., Int. Conf. Solid-State Sensors and Actuators, (1997), 833 Google Scholar
12. Tsai, T.H., Teo, K.B.K. and Milne, W.I., J. Vac.Sci. Technol. B20 (2002) 1 Google Scholar
13. Smee, S.A., Gaitan, M., Novotny, D.B., Joshi, Y. and Blackburn, D.L., IEEE Electron Device Lett. 21 (2000) 12 Google Scholar