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Stress Analysis of 4-Point Bend Test for Thin Film Adhesion

Published online by Cambridge University Press:  10 February 2011

Sassan Roham ,
Kedar Hardikar  and
Peter Woytowitz
Sassan Roham
Affiliation:
Novellus Systems, Inc. San Jose, CA
Kedar Hardikar
Affiliation:
Novellus Systems, Inc. San Jose, CA
Peter Woytowitz
Affiliation:
Novellus Systems, Inc. San Jose, CA
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Abstract

Four point bend (4PB) tests are currently used to characterize the adhesive strength of thin films. Of particular interest are low k films whose strength properties are normally less than traditional dielectrics. A finite element analysis (FEA) of a 4PB specimen is conducted in order to better understand the results and limitations of such testing. We discuss the classical equation used to convert 4PB test data into fracture energy and have validated this classical formula using finite element analysis. We also present a theory that explains one possible reason for the occurrence of anomalous test results where the film fails in a cohesive rather than an adhesive mode.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 778: Symposium U – Mechanical Properties Derived from Nanostructuring Materials , 2003 , U3.11
Copyright
Copyright © Materials Research Society 2002

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