Hostname: page-component-586b7cd67f-g8jcs Total loading time: 0 Render date: 2024-11-25T15:19:32.780Z Has data issue: false hasContentIssue false
  • English
  • Français

A Streamlined Technique for Preparation of Transverse Specimens for Transmission Electron Microscopy

Published online by Cambridge University Press:  16 February 2011

F. Shaapur  and
M. Park
F. Shaapur
Affiliation:
Facility for High Resolution Electron Microscopy, Center for Solid State Science, Arizona State University, Tempe, AZ 85287
M. Park
Affiliation:
Facility for High Resolution Electron Microscopy, Center for Solid State Science, Arizona State University, Tempe, AZ 85287
Get access

Abstract

A procedure for batch processing of up to four specimens for cross-sectional transmission electron microscopy (X-TEM) has been developed. The technique is essentially an extension of the standard multi-slice composite full disc sample preparation method. However, disc cutting and dimple grinding steps have been eliminated. The trimming, gluing, stacking, and sectioning of the wafers from the original sample material to produce composite transverse sections are identical to those of the standard scheme. Grinding and polishing of the sections are carried out in a batch mode which, in turn, reduces the overall processing time per specimen. The prepared composite foils are mounted on metallic disc grids which provide structural support during ion thinning and microscopy.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 199: Symposium W – Specimen Preparation for Transmission Electron Microscopy of Materials II , 1990 , 177
Copyright
Copyright © Materials Research Society 1990

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Bravman, J.C. and Sinclair, R., J. Electron Microsc. Tech. 1, 53 (1984).Google Scholar
2. Helmersson, U. and Sundgren, J., J. Electron Microsc. Tech., 4, 361 (1986).Google Scholar
3. Du, A.Y. and Chu, Y.M., J. Electron Microsc. Tech., 7, 319 (1987).Google Scholar
4. Rai, A.K., Rashid, M.H., Pr-onko, P.P., Ezis, A., Langer, D.W., J. Electron Microsc. Tech., 5, 45 (1987).Google Scholar
5. Benedict, J.P., Klepeis, S.J., Vandygrift, W.G., Anderson, R., EMSA Bull. 19:2, 74 (1989).Google Scholar