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Strain Rate Dependent Behavior of Pure Aluminum and Copper Micro-Wires

Published online by Cambridge University Press:  21 March 2011

P. A. El-Deiry  and
R. P. Vinci
P. A. El-Deiry
Affiliation:
Department of Materials Science and Engineering, Lehigh University Bethlehem, PA 18015, U.S.A.
R. P. Vinci
Affiliation:
Department of Materials Science and Engineering, Lehigh University Bethlehem, PA 18015, U.S.A.
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Abstract

In order to shed light on the role that grain boundaries and dislocations play in anelastic relaxation of thin films and small-scale structures, we measured the effective elastic moduli of 99.99% pure Al and Cu 10 m m diameter micro-wires in the as-received (drawn and slight tempered) and annealed states. Moduli were determined using microtensile tests at various strain rates (6.7x10-6s-1, 1.3x10-5s-1, 2.6x10-5s-1, 4.5x10-5s-1, 2.5x10-4s-1, 4.5x10-4s-1). Focused-ion beam scanning electron microscopy was used for imaging grain sizes. Results from the as-received wires are compared with the annealed wires to illustrate the effects of grain size and dislocation density on effective moduli, which closely relates to grain boundary sliding and dislocation motion, respectively. We conclude that microstructure is more significant than scale in inducing anelasticity in small-scale wires and, by extension, thin films.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 695: Symposium L – Thin Films: Stresses and Mechanical Properties IX , 2001 , L4.2.1
Copyright
Copyright © Materials Research Society 2002

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References

REFERENCES

1. Huang, Haibo and Spaepen, F., “Tensile Testing of Free-standing Cu, Ag, And Al Thin Films and Ag/Cu Multilayers,” Acta. Mater. 48, 3261–3269, 2000.Google Scholar
2. Cornella, G., “Monotonic and Cyclic Testing of Thin Film Materials for MEMS Applications,” PhD. Thesis, Department of Materials Science and Engineering, Stanford University, 1999.Google Scholar
3. Vinci, R.P., Cornella, G., Bravman, J.C., “Anelastic Effects in Freestanding Al Thin Films,” Proc. 5th International Workshop on Stress Induced Phenomena in Metallization, Stuttgart, Germany, June, 1999, pp. 240–8.Google Scholar
4. ASM Materials Engineering Dictionary, edited by Davis, J.R., ASM International, 1992.Google Scholar
5. Reed-Hill, Robert E., Abbaschian, Reza, Physical Metallurgy Principles, 3rd Edition, PWS Publishing Company, Boston, MA, 1994.Google Scholar
6. Essawi, R.A., Hussein, N.M., Youssef, T.H., “Annealing mechanisms of commercially pure aluminum alloy wires,” Indian Journal of Pure & Applied Physics, 28, 719–720, 1990.Google Scholar
7. Lee, Hoo-Jeong, Cornella, Guido, Bravman, John C., “Stress relaxation of free-standing aluminum beams for microelectromechanical systems applications,” Applied Physics Letters, 76, 23 3415–3417, June 2000.Google Scholar
8. Huang, Haibo, “Mechanical Properties of Free-Standing Polycrystalline Metallic Thin Films and Multilayers,” PhD Thesis, Department of Physics, Harvard University, 1998.Google Scholar