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Sticking Probability and Step Coverage Studies of SiO2 and Polymerized Siloxane Thin Films Deposited by Plasma Enhanced Chemical Vapor Deposition

Published online by Cambridge University Press:  15 February 2011

Jeremy A. Theil
Jeremy A. Theil*
Affiliation:
Central Research Laboratory, Johnson Controls, Inc., Milwaukee, WI, 53209
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Abstract

This paper describes a method for estimating the effective sticking probability for plasma enhanced chemical vapor deposition (PECVD) of hexamethyldisiloxane (HMDSO) using SiO2 and polymerized siloxanes deposited on specially prepared trench structures. Comparison of the data with direct Monte-Carlo simulation curves provides information about the incorporation probability relative to film growth. It is shown that besides variation in gas chemistry, the choice of trench and film dimensions influences the step coverage. The sticking probability is shown to increase with oxygen flow rate by about 30%, from 0:1 to 10:1 02:HMDSO flow ratio. This flow rate dependence is found to be consistent with work performed on tetraethoxysilane.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 385: Symposium N – Polymer/Inorganic Interfaces II , 1995 , 97
Copyright
Copyright © Materials Research Society 1995

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References

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