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Stereoimaging Determination of Strains in Surface Mounted Components and Plated Through Holes Resulting from Thermal Cycung

Published online by Cambridge University Press:  26 February 2011

David L. Davidson
David L. Davidson*
Affiliation:
Southwest Research Institute, P.O. Box 28510, San Antonio, Texas 78228
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Abstract

The experimental mechanics of microelectronics components requires high spatial resolution measurements that are best obtained by using the scanning microscope because of the high spacial resolution and depth of field obtained using this instrument. This paper describes how measurements made from photographs taken in the scanning electron microscope have been used successfully to determine the strains which develop due to differences in coefficient of thermal between various parts of microelectronic components. Results are presented for thermal strains in the solder joints of a surface mounted component and in a printed circuit board plated through hole.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 226: Symposium H – Mechanical Behavior of Materials and Structures in Microelectronics , 1991 , 357
Copyright
Copyright © Materials Research Society 1991

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References

1. Solder Mechanics: A State of the Art Assessment, edited by Frear, D.R., Jones, W.B., and Kinsman, K.R., The Metall. Soc., Warrendale, PA, 1991.Google Scholar
2. Lau, J.H. and Rice, D.W., sol. state tech. 28, 91 (1985).Google Scholar
3. Lau, J.H. and Rice, D.W., ISTF A/86, 73 (1986).Google Scholar
4. Davidson, D.L., Scanning Electron Microscopy/1979/11 (SEM, Inc., AMF O'Hare, IL, 1979), p. 79.Google Scholar
5. Williams, D.E., Davidson, D.L., and Lankford, J., Experimental Mechanics 20, 134 (1980).Google Scholar
6. Franke, E.A., Wenzel, D.J. and Davidson, D.L. Rev. of Sci. Instruments (1991) (in press).Google Scholar
7.Solder Data, International Tin Research Institute Publ. 656, Uxbridge, UK, p. 38ff.Google Scholar