Hostname: page-component-7bb8b95d7b-w7rtg Total loading time: 0 Render date: 2024-09-12T13:02:57.786Z Has data issue: false hasContentIssue false
  • English
  • Français

Stamp Deformation During Microcontact Printing

Published online by Cambridge University Press:  01 February 2011

Anand Jagota ,
Kenneth G. Sharp  and
David F. Kristunas
Anand Jagota
Affiliation:
E.I. du Pont de Nemours and Co., Inc., Central Research Department, Wilmington, DE 19880-0323
Kenneth G. Sharp
Affiliation:
E.I. du Pont de Nemours and Co., Inc., Central Research Department, Wilmington, DE 19880-0323
David F. Kristunas
Affiliation:
E.I. du Pont de Nemours and Co., Inc., Central Research Department, Wilmington, DE 19880-0323
Get access

Abstract

Stamp deformation often produces undesirable effects that limit the practice and precision of micro-contact printing. We have experimentally studied one of the most pervasive consequences of undesired deformation: roof collapse of low-aspect-ratio recesses. Stamp behavior under increasing loads can readily be assessed by mounting stamps on flat glass and viewing stamps from below through an inverted microscope. Dynamic as well as limiting equilibrium behavior can be determined. Features with aspect ratios varying by a factor of ten were examined. We find that roof collapse initiates with the formation of a contact between the roof of the stamp and the substrate. This is followed by rapid growth of the contact region, driven by attractive interfacial forces. Contact growth usually terminates leaving a noncontacting “moat” region. Experimental measurements of the critical stress for roof collapse are in very good agreement with theory.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 728: Symposium S – Functional Nanostructured Materials through Multiscale Assembly and Novel Patterning Techniques , 2002 , S8.41
Copyright
Copyright © Materials Research Society 2002

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1. Kumar, A., Whitesides, G.M., Appl. Phys. Lett. 63, 2002 (1993).Google Scholar
2. Kumar, A., Biebuyek, H.A., Whitesides, G.M., Langmuir 10, 1498 (1994).Google Scholar
3.Manufactured by Dow Corning CorpGoogle Scholar
4. Biebuyck, H.A., Larsen, N.B., Delamarche, E. and Michel, B., IBM J. Res. Develop. 41, 1, 159 (1997).Google Scholar
5. Schmid, H., Michel, B., Macromolecules 33, 3042–3049 (2000).Google Scholar
6. Delamarche, E., Schmid, H., Michel, B., Biebuyck, H., Adv. Mater. 9, 741 (1997).Google Scholar
7. Hui, C. Y., Jagota, A., Lin, Y.Y., Kramer, E. J., Langmuir, in press (2002).Google Scholar
8. Hui, C.Y., Jagota, A., Lin, Y.Y., Kramer, E.J., Proceedings of the Annual Meeting of the Adhesion Society, in press (2002).Google Scholar
9. Johnson, K.L., Contact Mechanics, Cambridge University Press (1985).Google Scholar
10. Johnson, K.L., Kendall, K., Roberts, A.D., Proc. R. Soc. London, Ser. A; 324, 301 (1971).Google Scholar
11. Hui, C.Y., Baney, J.M., and Kramer, E.J., Langmuir 14, 6570 (1998).Google Scholar