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Solvent-Induced Damage in Polyimide Thin Films

Published online by Cambridge University Press:  21 February 2011

M. S. Hu
M. S. Hu*
Affiliation:
Materials Department, College of Engineering, University of California, Santa Barbara, CA 93106
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Abstract

Solvent induced damage bands formed in residually strained polyimide thin films on different substrates have been studied. Microscopy studies have shown that these bands resemble crazes. A mechanics approach Is taken to understand the band formation phenomenon.

The critical strain for damage formation has been identified. This strain decreases with increase in exposure time, but always exhibits a threshold value. In contrast to the cracking of brittle films, the critical strain has only a weak dependence on the film thickness over a wide range. This behavior obtains because the crazing of the polyimide films is nucleation controlled. Strain-enhanced diffusion of solvent into the films is considered to be responsible for the property degradation that leads to damage formation.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 167: Symposium K – Advanced Electronic Packaging Materials , 1989 , 153
Copyright
Copyright © Materials Research Society 1990

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References

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