Hostname: page-component-cd9895bd7-hc48f Total loading time: 0 Render date: 2024-12-27T02:19:02.813Z Has data issue: false hasContentIssue false

Solidification Microstructure Evolution Modeling in Nb-Si Based Intermetallics-Strengthened-Metal-Matrix Composites

Published online by Cambridge University Press:  21 September 2018

Sujoy Kar
Affiliation:
GE Global Research Center, Bangalore, KA, India, 560066
Bernard Bewlay
Affiliation:
GE Global Research Center, Niskayuna, NY, USA, 12309
Ying Yang
Affiliation:
CompuTherm LLC, Madison, WI, USA, 53719
Get access

Abstract

For higher fuel efficiency and greater thrust to weight ratios, there is a continuous drive for higher performance turbine engine components. Nb-silicide intermetallics, owing to their high melting point and high-temperature strength, are potential candidates for high temperature applications. These intermetallics when precipitated in the metal matrix of a (Nb) solid solution, result in intermetallic-strengthened metal matrix composites that have a good combination of room temperature toughness and high temperature strength. The microstructures of these in-situ composites can be complex and vary significantly with the addition of elements such as Ti and Hf. Hence an improved understanding of phase stability and the microstructural evolution of these alloys is essential for alloy optimization. In the present paper we describe binary alloy microstructural evolution modeling of dendritic and eutectic solidification obtained using phasefield simulations. The effect of parameters such as heat extraction rate, the ratio of the diffusivity of the solute in liquid to solid, and the liquid-solid interfacial energy, on microstructural evolution during solidification is discussed in detail.

Type
Articles
Copyright
Copyright © Materials Research Society 2009

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1. Chen, L.Q., Annu. Rev. Mater. Res., 32, 113 (2000).Google Scholar
3. Liang, H. and Chang, Y.A., Intermetallics, 7, 561 (1999).Google Scholar
4. Karma, A. and Rappel, W.J., Phys. Rev. E., 53, 3017 (1996).Google Scholar
5. Kobayashi, R., Physica D., 63, 410 (1993).Google Scholar
6. Steinbach, I., Pessolla, F., Nestler, B., Seeßelberg, M., Prieler, R., Schmitz, G.J., and Rezende, J.L.L., Physica D., 94, 135 (1996).Google Scholar
7. Karma, A., Rappel, W.J., Phys. Rev. E., 60, 3614 (1999).Google Scholar
8. Jeong, J.H., Goldenfield, N., Dantzig, J.A., Phys. Rev. E, 64, 041602 (2001).Google Scholar
9. Lewis, D., Pusztai, T., Granasy, L., Warren, J., Boettinger, W., JOM, 35 (2004).Google Scholar
10. Private communication with MICRESS support group.Google Scholar
11. Chang, K.-M., Bewlay, B.P., Sutliff, J.A. and Jackson, M.R., JOM, 59 (1992).Google Scholar