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Sol-Gel Deposition of Electronic Ceramic Films.

Published online by Cambridge University Press:  28 February 2011

J.M. Bell
Affiliation:
University of Technology, Sydney, P.O. Box 123, Broadway, NSW, 2007 Australia
B. Ben-Nissan
Affiliation:
University of Technology, Sydney, P.O. Box 123, Broadway, NSW, 2007 Australia
M. Anast
Affiliation:
University of Technology, Sydney, P.O. Box 123, Broadway, NSW, 2007 Australia
B.O. West
Affiliation:
Department of Chemistry, Monash University, Clayton, Victoria, 3168, Australia
L. Spiccia
Affiliation:
Department of Chemistry, Monash University, Clayton, Victoria, 3168, Australia
J. Cullen
Affiliation:
Department of Chemistry, Monash University, Clayton, Victoria, 3168, Australia
I. Watkins
Affiliation:
Department of Chemistry, Monash University; and Silicon Technologies Australia, 22 Sophia Street, Crows Nest, NSW, 2065, Australia
D. Devilliers
Affiliation:
Department of Chemistry, Monash University, Clayton, Victoria, 3168, Australia
G. Johnston
Affiliation:
Defence Science and Technology Organisation, P.O. Box 50, Ascot Vale, Victoria, 3032, Australia.
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Abstract

We describe a dip-coating method of depositing thin electronic ceramic coatings on various substrates from sol-gel solutions. The solutions we use are alkoxide-based, although the specific formulations depend on the system being deposited. We are working with two electronic ceramic systems: barium titanate on glass, and alumina, and yttrium barium copper oxide on alumina. We discuss methods used to reduce and remove processing defects such as crazing, cracking and pin-holing. We are also studying the effects of varying the processing conditions (dipping, hydrolysis and firing) on the electronic properties of the films. Initial results on BaTiO3 indicate that it is better to deposit thin films (∼0.1 – 0.2μm) and build up the coating thickness by repeated dipping.

Type
Research Article
Copyright
Copyright © Materials Research Society 1990

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References

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