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Sol-Gel Casting of Ceramic Microcomponents

Published online by Cambridge University Press:  10 February 2011

C. M. Chan  and
G. Z. Cao
C. M. Chan
Affiliation:
University of Washington, Department of Materials Science and Engineering, Seattle, WA
G. Z. Cao
Affiliation:
University of Washington, Department of Materials Science and Engineering, Seattle, WA
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Abstract

Development of ceramic microcomponents can open up the current silicon-based MEMS technology to new applications, especially for use in high temperature, chemically reactive environments. We report a study of sol-gel technologies applied to the fabrication of microcomponents. Organic/inorganic hybrid materials, particularly silica-based hybrids, were developed by sol-gel processing. A weak silica network was made possible by using acid catalyst, low functionality organic precursor in the sol preparation. Since the weak network has a high tendency to collapse, the result is a denser material. Incorporation of organic ligands modifies the surface chemistry of gel network so that a greater drying stress was developed and a denser hybrid structure was achieved without high temperature treatment. In addition, the incorporation of organic ligands prevented formation of cracks. Nanoscale oxide particles were dispersed and incorporated into the gel network by surface condensation. The incorporation of solid nanoparticles into sols greatly reduced the shrinkage of gels and enhanced the mechanical strength of the components. In addition, silica sol was applied to coat metallic microcomponents and a thin uniform was formed.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 546: Symposium AA – Materials Science of Microelectromechanical Systems (MEMS)… , 1998 , 171
Copyright
Copyright © Materials Research Society 1999

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