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Smart Lead-Free Solders via Shape-Memory Alloy Reinforcement

Published online by Cambridge University Press:  26 February 2011

Indranath Dutta ,
Bhaskar S. Majumdar ,
Tiandan chen ,
Koh Choon Chung  and
Bing Ye
Indranath Dutta
Affiliation:
[email protected], Naval Postgraduate School, Department of Mechanical and Astonautical Engineering, 700 Dyer Road, Monterey, CA, 93943, United States, 1-831-656-2851, 1-831-656-2238
Bhaskar S. Majumdar
Affiliation:
[email protected], New Mexico Tech, Department of Materials Science and Engineering, Socorro, NM, 87801, United States
Tiandan chen
Affiliation:
[email protected], Naval Postgraduate School, Department of Mechanical and Astonautical Engineering, 700 Dyer Road, Monterey, CA, 93943, United States
Koh Choon Chung
Affiliation:
[email protected], Naval Postgraduate School, Department of Mechanical and Astonautical Engineering, 700 Dyer Road, Monterey, CA, 93943, United States
Bing Ye
Affiliation:
[email protected], New Mexico Tech, Department of Materials Science and Engineering, Socorro, NM, 87801, United States
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Abstract

Microelectronic solder joints are exposed to aggressive thermo-mechanical cycling (TMC) during service, resulting in strain localization near solder / bond-pad interfaces, which eventually leads to low-cycle fatigue (LCF) failure of the joint. In order to mitigate these strain concentrations and thereby improve LCF life, a ‘smart solder’ reinforced with a martensitic NiTi based shape memory alloy (SMA) is being developed. This paper presents an overview of processing, characterization and modeling of these composite solders, and articulates the role of NiTi particles on strain evolution in composite solders. Based on finite element modeling and experiments on model single fiber composites, it is shown that NiTi pariculate reinforcements can reduce inelastic strain levels in the solder via shape recovery associated with the B19′→B2 transformation. In situ TMC studies in the SEM, in conjunction with strain analysis via digital image correlation, show evidence of reverse deformation in the solder commensurate with the NiTi phase transformation, demonstrating the conceptual viability of the smart solder approach. Details of processing and joint formation, and the resultant microstructures of smart solder are discussed. Finally, results of TMC experiments on monolithic solder and NiTi/solder composite joints are reported, highlighting the beneficial effect of shape-memory transformation in reducing inelastic strain range, and hence enhancing the LCF life, of solders.

Keywords

solderingphase transformationscanning electron microscopy (SEM)
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 968: Symposium V – Advanced Electronic Packaging , 2006 , 0968-V06-04
Copyright
Copyright © Materials Research Society 2007

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References

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