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The Slip Transfer Process Through Grain Boundaries in HCP Ti

Published online by Cambridge University Press:  21 February 2011

J. Shirokoff ,
I.M. Robertson  and
H.K. Birnbaum
J. Shirokoff
Affiliation:
Department of Materials Science and Engineering and Materials Research Laboratory University, of Illinois 1304 W. Green St., Urbana IL 61801
I.M. Robertson
Affiliation:
Department of Materials Science and Engineering and Materials Research Laboratory University, of Illinois 1304 W. Green St., Urbana IL 61801
H.K. Birnbaum
Affiliation:
Department of Materials Science and Engineering and Materials Research Laboratory University, of Illinois 1304 W. Green St., Urbana IL 61801
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Abstract

Information on the mechanisms of slip transfer across grain boundaries in an HCP α-Ti alloy has been obtained from deformation experiments performed In situ in the transmission electron microscope. Initially, lattice dislocations are accommodated within the grain boundary until a critical local dislocation density is reached. The boundary then responds by activating slip in the adjoining grain on the slip system experiencing the highest local resolved shear stress and producing the residual grain-boundary dislocation with the smallest Burgers vector. Slip on secondary slip systems may be initiated provided they reduce the magnitude of the Burgers vector of, or eliminate, the residual grainboundary dislocation. The selection rules used to predict the slip system activated by the grain boundary are the same as apply in ordered and disordered FCC materials.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 319: Symposia CB – Defect-Interface Interactions , 1993 , 263
Copyright
Copyright © Materials Research Society 1994

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