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A Simple Model for Stress Voiding in Passivated Thin Film Conductors

Published online by Cambridge University Press:  15 February 2011

J. R. Lloyd  and
E. Arzt
J. R. Lloyd
Affiliation:
also with Digital Equipment Corporation, 77 Reed Road, Hudson MA 01749-2895, USA
E. Arzt
Affiliation:
Max Planck Institut für MetaUforschung, Institut für Werkstoffwissenschaft, Seestraße 71, D-7000, Stuttgart 1, Germany
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Abstract

A model is proposed for stress voiding in passivated thin film conductors. The rate limiting step is argued to be the formation of vacancies at dislocation jogs which then diffuse to void sites.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 265: Symposium H – Materials Reliability in Microelectronics II , 1992 , 45
Copyright
Copyright © Materials Research Society 1992

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References

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