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Published online by Cambridge University Press: 21 February 2011
The effects of various ex-situ and in-situ silicon surface cleaning techniques on low temperature epitaxial growth down to 650°C have been characterized. For ex-situ cleaning, wet HF cleans with and without a chemically grown oxide were compared along with vapor HF cleaning. In-situ cleaning was achieved by rapid thermal cleaning (RTC), a 1min. hydrogen bake at various temperatures. When the residual surface oxide was >2e15/cm2 or fluorine >4e13/cm2, a continuous interface was observed and epitaxial growth could not be achieved (conical/columnar poly deposition). By optimizing the in-situ RTC process for either wet or vapor HF ex-situ clean, high quality low temperature epitaxial growth was realized.