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A Shape Memory Polymer with Improved Shape Recovery*

Published online by Cambridge University Press:  01 February 2011

Changdeng Liu  and
Patrick T. Mather
Changdeng Liu
Affiliation:
Chemical Engineering, University of Connecticut
Patrick T. Mather
Affiliation:
Institute of Material Science, University of Connecticut
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Abstract

Thermally actuated shape memory polymers (SMPs) interest, both academically and industrially, due to their ability to memorize a permanent shape that is set during processing and a temporary shape that is later programmed by manipulation above a critical temperature, either Tg or Tm. However, the thermal triggering process for SMPs is usually retarded compared to that of shape memory alloys, because the thermal conductivity of polymers is much lower (<0.30 W/m.K). In the present study, we incorporated a highly thermal conducting filler into a shape memory matrix to increase its thermal conductivity and therefore, shorten the heat transfer progress. A mathematical was worked out that quantitatively relates the material's thermal conductivity with the heat transfer time, τ, also defined as a shape memory induction time. The model fit nicely with our experimental data. In addition, mechanical reinforcement was observed with the addition of this rigid thermal conducting filler.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 855: Symposium W – Mechanically Active Materials , 2004 , W4.7
Copyright
Copyright © Materials Research Society 2005

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Footnotes

*

Adapted from Chapter 6 of Changdeng Liu's PhD Dissertation, University of Connecticut (2004).

References

[1] Callister, William D. Jr, Material Science and Engineering: An Introduction, 5th ed. (John Wiley & Son, Inc., New York, 2000) p. 808–809 Google Scholar
[2] Liu, C. and Mather, P. T., in Annual Technical Conference - Society of Plastics Engineers (2004), May, 2004, Chicago IL Google Scholar
[3] Bird, R. B.; Stewart, W. E. and Lightfoot, E. N.; Transport Phenomena, (John Wiley & Sons Inc., New York, 1960) p. 354.Google Scholar
[4] Carslaw, H. S. and Jaegen, J. C., Conduction of Heat in Solid 2nd ed. (Oxford University Press, Oxford, UK, 1960) p. 173.Google Scholar
[5] ASTM E 1952: 2001. Standard Test Method for Thermal Conductivity and Thermal Diffusivity by Modulated Temperature Differential Scanning Calorimetry. pp. 6.Google Scholar