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Self-Consistent Mosfet Tunneling Simulations—Trends in the Gate and Substrate Currents and the Drain-Current Turnaround Effect with Oxide Scaling

Published online by Cambridge University Press:  10 February 2011

H. Z. Massoud
Affiliation:
Semiconductor Research Laboratory, Department of Electrical and Computer Engineering, Duke University, Durham, NC, 27708-0291
J. P. Shiely
Affiliation:
Semiconductor Research Laboratory, Department of Electrical and Computer Engineering, Duke University, Durham, NC, 27708-0291
A. Shanware
Affiliation:
Semiconductor Research Laboratory, Department of Electrical and Computer Engineering, Duke University, Durham, NC, 27708-0291
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Abstract

This paper discusses the simulation needs of deep-submicron MOSFETs beyond the 100 nm technology generation where the tunneling of carriers through the gate dielectric will become a vital issue in device design, optimization, and characterization. We present simulation results of Tunnel-PISCES, a MOSFET device simulator where tunneling in the gate dielectric is implemented in a self-consistent manner with the device equations in the substrate. Simulation results of trends in the gate, substrate, and drain currents with oxide scaling are presented. The drain-current turnaround effect is explained by considering the role of the voltage drop across the polysilicon gate resistance in determining the device gate tunneling conditions.

Type
Research Article
Copyright
Copyright © Materials Research Society 1999

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References

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