Hostname: page-component-78c5997874-g7gxr Total loading time: 0 Render date: 2024-11-19T05:33:32.997Z Has data issue: false hasContentIssue false
  • English
  • Français

Selective Electroless Copper Metallisation of Epoxy Substrates

Published online by Cambridge University Press:  15 February 2011

L. M. Campion ,
M. O'reilly ,
D. J. Macauley ,
P. V. Kelly  and
G. M. Crean
L. M. Campion
Affiliation:
National Microelectronics Research Centre, Lee Maltings, Prospect Row, Cork, Ireland.
M. O'reilly
Affiliation:
National Microelectronics Research Centre, Lee Maltings, Prospect Row, Cork, Ireland.
D. J. Macauley
Affiliation:
National Microelectronics Research Centre, Lee Maltings, Prospect Row, Cork, Ireland.
P. V. Kelly
Affiliation:
National Microelectronics Research Centre, Lee Maltings, Prospect Row, Cork, Ireland.
G. M. Crean
Affiliation:
National Microelectronics Research Centre, Lee Maltings, Prospect Row, Cork, Ireland.
Get access

Abstract

This paper discusses the development of a novel selective electroless copper metallisation route for the plating of epoxy substrates. This has the potential for the development of a more cost effective and environmentally friendly plating process than currently available technologies. The electroless process required that the electrically insulating epoxy substrate was initially activated to catalyse the reduction of the copper (I1) salt which was in solution to a copper (0) deposit. Selective activation was achieved by coating the epoxy substrates with a new proprietary palladium compound and selectively exposing specific areas to 222nm radiation from a KrCI* excimer lamp. It has been shown that only the palladium metal and not the proprietary precursor catalyse the reaction. After selective seeding the patterned epoxy substrates were copper plated in a commercial electroless copper bath. The process conditions and effect of surface preparation on the quality and resolution of the selectively deposited copper patterns are discussed.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 444: Symposium I – Materials for Mechanical and Optical Microsystems , 1996 , 69
Copyright
Copyright © Materials Research Society 1997

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

[ 1] Garrou, P., ‘Polymer Dielectrics for Multichip Module Packaging’, Proceedings of IEEE, 80, (1992),.Google Scholar
[2] Garrou, P., ‘Thin film interconnection Technology Boosts MCM Performance’, Electronic Packaging & Production, Oct (1992) pp 44–47.Google Scholar
[3] Farage, A. et al., ‘Manufacturing studies of BCB as the Interlevel Dielectric Material for multilevel Interconnect MCM and VLSI Applications’, ISI-M Proceedings, San Francisco, Oct, (1992) pp 596–600.Google Scholar
[4] Gross, et al, J. AppI. Phys. Lett. 60 (1992) 1628.Google Scholar
[5] DeSilva, M.J. and Pedraza, A.J., J. Mater. Res., 9, 4, (Apr 1994) pp 1019–1026.Google Scholar
[6] Yoon-Gi, Kim et al., J. Micromech. Microeng. 1, 42–45, (1991).Google Scholar
[7] Esrom, H., Demny, J. and Kogelschatz, U., Chemtronics, 4, (Sept 1989) pp 202–208.Google Scholar
[8] Mcauley, D.J., Kelly, P.V., Crean, G.M., ‘Ultraviolet Excimer Lamp Photoassisted Selective Palladium Activation of Coarse and Fine Grain Alumina Ceramic for Selective Electroless Copper Plating’, MRS Fall Meeting, Symposium J, (Dec 1996).Google Scholar