Hostname: page-component-cd9895bd7-lnqnp Total loading time: 0 Render date: 2024-12-27T01:48:34.423Z Has data issue: false hasContentIssue false
  • English
  • Français

Round-Robin Tests of Modulus and Strength of Polysilicou

Published online by Cambridge University Press:  10 February 2011

W. N. Sharpe Jr. ,
S. Brown ,
G. C. Johnson  and
W. Knauss
W. N. Sharpe Jr.
Affiliation:
ME Department, Johns Hopkins University, Baltimore, MD 21218, [email protected]
S. Brown
Affiliation:
Exponent Failure Analysis Associates, Framingham, MA 01701
G. C. Johnson
Affiliation:
ME Department, U. C. Berkeley, Berkeley, CA 94720
W. Knauss
Affiliation:
Aeronautics and Applied Mechanics, Caltech, Pasadena, CA 91125
Get access

Abstract

The Young's modulus and strength of polysilicon specimens manufactured in the same production run were measured in four different laboratories. Specimens subjected to in-plane bending were tested at U. C. Berkeley and at Failure Analysis Associates, and tensile measurements were made at Caltech and Johns Hopkins. All specimens were produced at the Microelectronics Center of North Carolina (MCNC).

In bending, the Young's modulus for specimens nominally 2 µm thick was measured as 174 GPa and 137 GPa; whereas in tension, a value of 132 GPa was obtained. Modulus values of 136 GPa and 142 GPa were measured in tension on specimens nominally 1.5 µm and 3.5 µm thick. Strengths of the brittle polysilicon were 2.8 and 2.7 GPa in bending and 1.3 GPa for both thicknesses in tension.

These preliminary results were presented at Symposium N - Microelectromechanical Structures for Materials Research at the Materials Research Society meeting in April 1998. This paper is a short overview of the test methods — each of which is described elsewhere — and a documentation of the results presented at that time.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 518: Symposium N – Microelectromechanical Structures for Materials Research , 1998 , 57
Copyright
Copyright © Materials Research Society 1998

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1 ASTM Committee E-1 1 on Quality Control of Materials, “ASTM Manual for Conducting an Interlaboratory Study of a Test Method”, ASTM STP 335, (1963).Google Scholar
2 Newman, J. C. Jr., and Edwards, P. R., “Short-Crack Growth Behaviour in an Aluminum Alloy - an AGARD Cooperative Test Programme”, AGARD Report No. 372, (1988).Google Scholar
3 Legros, M., Kumar, S., Jayaraman, S., Hemker, K. J., and Sharpe, W. N. Jr., “Microstructural Observations of LPCVD Double Layer Polysilicon Thin Film Tensile Specimens,” Polycrystalline Thin Films, MRS Symposium Proceedings, 472, pp. 275–280, (1997).Google Scholar
4 Gupta, R. K., Osterberg, P. M., and Senturia, S. D.,”Material Properties Measurements of Micromechanical Polysilicon Beams”, Microlithography and Metrology in Micromachining 11, SPIE Vol. 2880, Austin, Texas, pp. 39–45, (1996).Google Scholar
5 Read, D. T. and Marshall, J. C.,”Measurements of Fracture Strength and Young's Modulus of Surface-Micromachined Polysilicon,” Microlithography and Metrology in Micromachining II, SPIE Vol. 2880, pp. 56–63, (1996).Google Scholar
6 Sharpe, W. N. Jr., Yuan, B., Edwards, R. L., and Vaidyanathan, R., “Measurements of Young's modulus, Poisson's ratio, and Tensile Strength of Polysilicon”, Proceedings of the Tenth IEEE International Workshop on Microelectromechanical Systems, Nagoya, Japan, pp. 424–429, (1997).Google Scholar
7 Jones, P. T., Johnson, G. C., and Howe, R. T., “Fracture Strength of Polycrystalline Silicon”, presented at Microelectromechanical Structures for Materials Research - Symposium N, Materials Research Society and accepted for publication in the proceedings (April, 1998).Google Scholar
8 Chasiotis, I. and Knauss, W., “Mechanical Properties of Thin Polysilicon Films by Means of Probe Microscopy”, Materials and Device Characterization in Micromachining, SPIE Vol. 3512, (1998).Google Scholar
9 Brown, S., Muhlstein, C., and Arsdell, W. Van, “Advances in Fatigue Testing of MEMS Materials”, presented at Microelectromechanical Structures for Materials Research - Symposium N, Materials Research Society and accepted for publication in the proceedings (April, 1998).Google Scholar
10 Sharpe, W. N. Jr., Turner, K., and Edwards, R. L., “Polysilicon Tensile Testing with Electrostatic Gripping”, presented at Microelectromechanical Structures for Materials Research - Symposium N, Materials Research Society and accepted for publication in the proceedings (April, 1998).Google Scholar
11 Greek, S. and Johansson, S., “Tensile Testing of Thin Film Microstructures”, Micromachined Devices and Components III - SPIE, Volume 3224, pp. 344–351, (1997).Google Scholar
12 Greek, S. and Ericson, F., “Young's Modulus, Yield Strength and Fracture Strength of Microelements Determined by Tensile Testing”, presented at Microelectromechanical Structures for Materials Research - Symposium N, Materials Research Society and accepted for publication in the proceedings (April, 1998).Google Scholar
13 Mullen, R. L., Ballarini, R., Yin, Y., and Heuer, A. H., “Monte Carlo Simulation of Effective Elastic Constants of Polycrystalline Thin Films”, Acta Materialia, Vol. 45, No. 6, pp. 2247–2255, (1997).Google Scholar
14 Lee, S. and Cho, D. D., “The Effects of Texture on the Young's Modulus of Polysilicon”, presented at Microelectromechanical Structures for Materials Research - Symposium N, Materials Research Society and accepted for publication in the proceedings (April, 1998).Google Scholar
15 Tsuchiya, T., Tabata, T., Sakata, S., and Tagi, Y., “Specimen Size Effect on Tensile Strength of Surface Micromachined Polycrystalline Silicon Thin Films,” Proceedings of the Tenth IEEE International Workshop on Microelectromechanical Systems, Nagoya, Japan, pp. 529–534, (1997).Google Scholar