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Role of Kinetic Energy of Sputtered Particles in Thin Film Properties

Published online by Cambridge University Press:  25 February 2011

Yasunori Taga
Yasunori Taga*
Affiliation:
TOYOTA Central Research and Development Laboratories, Inc., Nagakute, Aichi 480-11, Japan
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Abstract

The thin film processes of the sputter deposition method have been reviewed with special emphasis on the effects of kinetic energy of sputtered particles and ion bombardment during deposition on thin film properties. An overview is first given to describe the thin film process and ion-surface interactions, where the methods of measuring the energy distribution of sputtered ions and the anisotropic-emission-effect sputter deposition are presented. Experimental results for Cr, SiO2 and Ni-Si-B films are presented, and the correlation between the structure and properties of the thin films is discussed. Research in modification of thin films by energetic atoms and ions is an exciting area of materials science in the future.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 268: Symposium K – Materials Modification by Energetic Atoms and Ions , 1992 , 95
Copyright
Copyright © Materials Research Society 1992

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