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A Review of Tension Test Methods for Thin Films

Published online by Cambridge University Press:  01 February 2011

William N. Sharpe Jr.
William N. Sharpe Jr.*
Affiliation:
[email protected], Johns Hopkins University, Mechanical Engineering, 3400 North Charles Street, Baltimore, MD, 21218, United States
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Abstract

Test methods for mechanical property measurement of the thin films used in MEMS have been developed and refined over the last decade. This brief review considers only tensile testing since that is the preferred method for measuring Young's modulus, strength, etc. for macroscale structural materials. There are basically two kinds of tensile specimens – framed specimens whose support strips are cut after mounting and semidetached specimens fastened to the substrate at one end. The loading and force measurement systems are similar and use commercial transducers. Strain is measured either by overall grip displacement or by digital imaging in most cases. Initial works are described and followed by descriptions of some recent applications. The paper concludes with a suggested test method that could be amenable to standardization.

Keywords

thin filmelastic propertiesstress/strain relationship
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 1052: Symposium DD – Microelectromechanical Systems–Materials and Devices , 2007 , 1052-DD01-01
Copyright
Copyright © Materials Research Society 2008

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