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Residual Stress Effects in the Scratch Adhesion Testing of Tantalum Thin Films

Published online by Cambridge University Press:  15 February 2011

Richard L. White ,
John Nelson  and
William W. Gerberich
Richard L. White
Affiliation:
IBM Adstar, 5600 Cottle Road, San Jose, Ca 95193
John Nelson
Affiliation:
Center for Interfacial Engineering, University of Minnesota, 100 Union St S.E., Minneapolis, MN 55455
William W. Gerberich
Affiliation:
Center for Interfacial Engineering, University of Minnesota, 100 Union St S.E., Minneapolis, MN 55455
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Abstract

The effect of residual stress on the scratch adhesion critical load has been measured for sputtered tantalum films. In this single metallurgical system, six different failure modes could be observed, ranging from ductile ploughing to extensive spallation. For tantalum films deposited on silicon substrates, a 15% decrease in critical load was observed as the film residual stress increased from -1.1 GPa to +1.0 GPa. A larger percentage decrease (50%) was observed for films deposited on softer AIMg/NiP substrates. Film spallation was more extensive for films deposited over a thin carbon layer and for these films critical loads increased slightly with film stress. These results are substantially in contradiction with existing quantitative models for the scratch adhesion test and indicate that failure by shear at the film-substrate interface can be more important than failure by compressive buckling.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 308: Symposium M1 – Thin Films: Stresses and Mechanical Properties IV , 1993 , 141
Copyright
Copyright © Materials Research Society 1993

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References

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