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Residual stress and microstructural evolution in thin film materials for a micro solid oxide fuel cell (SOFC).

Published online by Cambridge University Press:  01 February 2011

David Quinn ,
S. Mark Spearing  and
Brian L. Wardle
David Quinn
Affiliation:
Department of Mechanical Engineering and Astronautics, Massachusetts Institute of Technology, Cambridge, MA 02139, U.S.A.
S. Mark Spearing
Affiliation:
Department of Aeronautics and Astronautics, Massachusetts Institute of Technology, Cambridge, MA 02139, U.S.A.
Brian L. Wardle
Affiliation:
Department of Aeronautics and Astronautics, Massachusetts Institute of Technology, Cambridge, MA 02139, U.S.A.
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Abstract

The stability of multilayered membrane structures is a major challenge in the development of microfabricated solid oxide fuel cells (SOFC). The work presented here explores residual stress in sputter-deposited yttria stabilized zirconia (YSZ) thin films (5nm – 1000nm thickness) as a function of deposition pressure and substrate temperature. The results indicate variations in intrinsic stress from ∼0.5GPa compressive to mildly tensile (∼50 MPa). Microstructure is characterized by x-ray diffraction (XRD). The evolution of intrinsic stress with temperature is investigated by thermally cycling YSZ films deposited on silicon wafers. Observed changes of 100s of MPa in the intrinsic stress component of the film serve as indicators of possible changes in microstructure. Such changes in microstructure are subsequently characterized using x-ray diffraction of as-deposited and annealed films. Correlations with relevant mechanisms and models of residual stress evolution are discussed. Finally, use of such residual stress data in the fabrication and design of mechanically stable multilayered membranes for micro SOFC devices is discussed.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 854: Symposium U – Stability of Thin Films and Nanostructures , 2004 , U8.19
Copyright
Copyright © Materials Research Society 2005

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References

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