Hostname: page-component-7479d7b7d-68ccn Total loading time: 0 Render date: 2024-07-09T08:58:26.315Z Has data issue: false hasContentIssue false
  • English
  • Français

Relation between texture and stress in thin sputtered molybdenum layers

Published online by Cambridge University Press:  21 March 2011

Ilse M. van den Berk ,
Léon J. Seijbel  and
Rob Delhez
Ilse M. van den Berk
Affiliation:
Laboratory for Materials Science, Delft University of Technology, Rotterdamseweg 137, 2628 AL Delft, Netherlands
Léon J. Seijbel
Affiliation:
Netherlands Institute for Metals Research, Rotterdamseweg 137, 2628 AL Delft, Netherlands email: [email protected]
Rob Delhez
Affiliation:
Laboratory for Materials Science, Delft University of Technology, Rotterdamseweg 137, 2628 AL Delft, Netherlands
Get access

Abstract

X-ray diffraction was used to measure the stress and the texture in thin molybdenum layers. The 500 nm thick layers were sputter deposited at various argon sputter pressures. All crystallites in the layers showed a strong tendency to develop a <110> direction perpendicular to the surface of the sample. Depending on the sputter pressure, a different fraction of the Mo crystallites developed a preference for a <110> direction parallel to the tangential direction of the rotating sputter table. The stresses found in the layer are best described when it is recognized that the crystallites in the layer belong to two groups: one group with both directions preferred and one group with only the out-of-plane direction preferred. For the intermediate sputter pressures the highest stresses were observed.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 672: Symposium O – Mechanisms of Surface and Microstructure Evolution in Deposited Films and Film Structures , 2001 , O3.22
Copyright
Copyright © Materials Research Society 2001

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

1. Vink, T.J., Somers, M.A.J., Daams, J.L.C., and Dirks, A.G., J. Appl. Phys. 70, 4301 (1991)Google Scholar
2. Klabunde, F., Löhmann, M., Bläsing, J., and Drüsedau, T., J. Appl. Phys. 80, 6266 (1996)Google Scholar
3. Karpenko, O.P., Vill, M., Malhotra, S.G., Bilello, J.C., and Yalisove, S.M. in Mechanisms of Thin Film Evolution, edited by Yalisove, S.M., Thompson, C.V., and Eaglesham, D.J. (Mater. Res. Soc. Proc. 317, Pittsburgh, PA, 1994) pp. 467–472 Google Scholar
4. Noyan, I.C. and Cohen, J.B. in Residual Stress, Measurement by Diffraction and Interpretation, (Springer-Verlag, New York, 1987)Google Scholar
5. Leeuwen, M. van, Kamminga, J.-D., and Mittemeijer, E.J. J. Appl. Phys. 86, 1904 (1999)Google Scholar
6unpublished resultsGoogle Scholar