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Reduction of Contact Resistance between NaxCoO2 Thermoelectric Chip and Ag Electrode by Using Spark Plasma Sintering Method.

Published online by Cambridge University Press:  22 May 2014

Haruna Hachiya
Affiliation:
Department of Materials Science and Technology, Tokyo University of Science, 3-6-1 Niijuku, Katsushika-ku, Tokyo 125-8585, Japan
Koya Arai
Affiliation:
Department of Materials Science and Technology, Tokyo University of Science, 3-6-1 Niijuku, Katsushika-ku, Tokyo 125-8585, Japan
Tomoyuki Nakamura
Affiliation:
SWCC Showa Cable Systems Co., Ltd., LTD, 4-1-1 Minami-Hashimoto Chuo-Ku Sagamihara, Kanagawa, Japan
Masahiro Minowa
Affiliation:
SWCC Showa Cable Systems Co., Ltd., LTD, 4-1-1 Minami-Hashimoto Chuo-Ku Sagamihara, Kanagawa, Japan
Yuki Yamaguchi
Affiliation:
Department of Pure and Applied Chemistry, Tokyo University of Science, 2641 Yamazaki, Noda-shi, Chiba 278-8510, Japan
Kenjiro Fujimoto
Affiliation:
Department of Pure and Applied Chemistry, Tokyo University of Science, 2641 Yamazaki, Noda-shi, Chiba 278-8510, Japan
Keishi Nishio
Affiliation:
Department of Materials Science and Technology, Tokyo University of Science, 3-6-1 Niijuku, Katsushika-ku, Tokyo 125-8585, Japan
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Abstract

NaxCoO2 has a particularly high contact resistance because it forms an insulated layer of NaHCO3 and Na2CO3, which are produced in a chemical reaction with carbon dioxide and water in air on the surface. In this study, we tried to improve the interface resistance between NaxCoO2 and Ag sheet electrodes by connecting these materials with the spark plasma sintering (SPS) technique. The interface resistance between NaxCoO2 and Ag sheet electrodes connected by SPS is compared with that connected with Ag paste. In an experiment, the interface resistance of a sample treated by decrease to less than 1/600 of the former value. It is thought that the NaHCO3 and Na2CO3 insulated layer is decomposed through the application of a large value of applied DC current by using the SPS technique.

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Articles
Copyright
Copyright © Materials Research Society 2014 

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References

REFERENCES

Terasaki, I., Sasago, Y. and Uchinpokura, K., Phys. Rev. B, 56, 12685 (1997)CrossRefGoogle Scholar
Terasaki, I., Sasago, Y. and Uchinokura, K., Proc.17th Int. Conf. on Thermoelectrics, pp. 564569 (1998)Google Scholar
Yakabe, H., Kikuchi, K., Terasaki, I., Sasago, Y. and Uchinokura, K., Proc. 16th Int. Conf. on Thermoelectrics. pp. 523527.hi (1997)CrossRefGoogle Scholar
Terasaki, I., Ishii, Y., Tanaka, D., Takahata, K. and Iguchi, Y.: Jpn. J. Appl. Phy. 40 L65-L67 (2001)CrossRefGoogle Scholar
Motzfeldt, K., The Journal of Physical Chemistry, pp. 139147(1955)CrossRefGoogle Scholar
Nagae, T., Yokota, M., Nose, M., Tomida, S., Kamiya, T. and Saji, S., Materials Transactions, Vol. 43, No.6 pp. 13901397 (2002)CrossRefGoogle Scholar
Nishio, K., Takahashi, K., Inaba, Y., Sakamoto, M., Iida, T., Tokiwa, K., Kogo, Y., Yasumori, A. and Watanabe, T., 23rd International Conference on Thermoelectrics-ITC2004 in Adelaide Proceedings CD (Paper No. #97), Released (2005)Google Scholar
Ito, M. and Furumoto, D., Journal of Alloys and Compounds, 450, pp. 494498 (2008)10.1016/j.jallcom.2006.11.032CrossRefGoogle Scholar