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Real-World Applications of Laser Direct Writing

Published online by Cambridge University Press:  10 February 2011

D. J. Ehrlich ,
Richard Aucoin ,
M. J. Burns ,
Kenneth Nill  and
Scott Silverman
D. J. Ehrlich
Affiliation:
Revise Inc., 79 Second Ave., Burlington MA 01803, [email protected]
Richard Aucoin
Affiliation:
Revise Inc., 79 Second Ave., Burlington MA 01803, [email protected]
M. J. Burns
Affiliation:
Revise Inc., 79 Second Ave., Burlington MA 01803, [email protected]
Kenneth Nill
Affiliation:
Revise Inc., 79 Second Ave., Burlington MA 01803, [email protected]
Scott Silverman
Affiliation:
Revise Inc., 79 Second Ave., Burlington MA 01803, [email protected]
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Abstract

Laser microchemical direct write deposition and etching methods have found an essential niche in debug and design for yield of wire-bonded and flip-chip integrated circuits. Future applications should develop in package-level system modification.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 624: Symposium V – Materials Development for Direct Write Technologies , 2000 , 9
Copyright
Copyright © Materials Research Society 2000

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References

REFERENCES

1 Ehrlich, D. J. and Tsao, J. Y., eds., Laser Microfabrication: Thin Film Processes and Lithography (Academic, Boston, 1989).Google Scholar
2 Silvermnan, S., Aucoin, R., Mallatt, J., Ehrlich, D., Proceedings from the 23rd Annual International Symposium for Testing and Failure Analysis, 211–213 (1997)Google Scholar
3 Livengood, R. H., Rao, V. R., FIB Techniques to Debug Flip-Chip Integrated Circuits, Semiconductor International, March 1998.Google Scholar
4 Sze, S. M., Physics of Semiconduictor Devices, Second Edition, p 42, John Wiley & Sons (1981)Google Scholar