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Real-Time Thermo-Mechanical and Adhesive Property Evaluation of Thin Films and Multi-Layers

Published online by Cambridge University Press:  22 February 2011

John A. Rogers  and
K. A. Nelson
John A. Rogers
Affiliation:
Massachusetts Institute of Technology, Department of Chemistry, Cambridge, MA 02139
K. A. Nelson
Affiliation:
Massachusetts Institute of Technology, Department of Chemistry, Cambridge, MA 02139
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Abstract

We describe an experimental method useful for in-situ real-time evaluation of viscoelastic, thermal and adhesive properties of thin films and multi-layer structures. We demonstrate how the technique is used to quantify the elastic moduli, and in-plane thermal diffusivity. We also show how it can be used to “spot check” for dis-bonds and to generate dis-bond “maps”.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 338: Symposium – Materials Reliability in Microelectronics IV , 1994 , 553
Copyright
Copyright © Materials Research Society 1994

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References

REFERENCES

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