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Real-Time Investigation of Solid and Liquid State Reactions In Au-Sn/Cu System

Published online by Cambridge University Press:  21 February 2011

Seyong Oh ,
Igor Y. Khandros  and
Janet L. Poetzinger
Seyong Oh
Affiliation:
IBM T.J. Watson Research Center, Yorktown Heights, NY 10598
Igor Y. Khandros
Affiliation:
IBM T.J. Watson Research Center, Yorktown Heights, NY 10598
Janet L. Poetzinger
Affiliation:
IBM General Technology Division, Hopewell Junction, NY 12533
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Abstract

A real-time x-ray analysis technique has been developed and employed for in-situ investigation of solid and liquid state reactions in Au-Sn/Cu system as a function of temperature. Typically, 1 μm eutectic Au-Sn films were deposited on 1.5 μm Cu layers on Si wafers. Phase changes in Au-Sn films on Cu from ambient to above the eutectic temperature have been investigated. Cu diffusion into Au-Sn film above 250 °C resulted in a ternary Au-Sn-Cu compound and raised the melting temperature of the structure to about 325 °C. This affects joining characteristics of the Au-Sn metallization.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 167: Symposium K – Advanced Electronic Packaging Materials , 1989 , 315
Copyright
Copyright © Materials Research Society 1990

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