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Real Time Study of Cu Diffusion through a Ru Thin Film by Photoemission Electron Microscopy (PEEM)

Published online by Cambridge University Press:  01 February 2011

Wayne P. Hess ,
Gang Xiong ,
Y.-M. Sun ,
Alan G. Joly ,
Kenneth M. Beck ,
J. M. White  and
Wayne P. Hess
Wayne P. Hess
Affiliation:
[email protected], Pacific Northwest National Laboratory, Chemical Structure and Dynamics, P. O. Box 999, Richland, WA 99352, USA, Richland, WA, 99352, United States
Gang Xiong
Affiliation:
[email protected], Pacific Northwest National Laboratory, Chemical Structure and Dynamics, Richland, WA, 99352, United States
Y.-M. Sun
Affiliation:
[email protected], The University of Texas at Austin, Department of Chemistry and Biochemistry, Austin, TX, 78712, United States
Alan G. Joly
Affiliation:
[email protected], Pacific Northwest National Laboratory, Chemical Structure and Dynamics, Richland, WA, 99352, United States
Kenneth M. Beck
Affiliation:
[email protected], Pacific Northwest National Laboratory, Chemical Structure and Dynamics, Richland, WA, 99352, United States
J. M. White
Affiliation:
[email protected], The University of Texas at Austin, Department of Chemistry and Biochemistry, Austin, TX, 78712, United States
Wayne P. Hess
Affiliation:
[email protected], Pacific Northwest National Laboratory, Chemical Structure and Dynamics, Richland, WA, 99352, United States
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Abstract

We demonstrate the efficacy of Photoemission Electron Microscopy (PEEM) as a tool to detect metal diffusion processes at nanoscale spatial resolution in real time. For a sample comprising a nominally 1 nm physical vapor-deposited (PVD) Ru thin film covering a thick Cu substrate, we have observed the appearance of bright features on a dark background as the temperature is monotonically increased and irradiated with photons from a Hg arc lamp. These bright features are the result of a lower work function due to Cu diffusion through the Ru film.

Keywords

diffusionCuphotoemission
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 914: Symposium F – Materials, Technology and Reliability of Low-k Dielectrics and Copper Interconnects , 2006 , 0914-F05-07
Copyright
Copyright © Materials Research Society 2006

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