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Rapid Thermal Oxidation of Polysilicon and Silicon
Published online by Cambridge University Press: 28 February 2011
Abstract
Growth kinetics of silicon dioxide films grown by rapid thermal processing on polysilicon and single crystal silicon films is described. Oxides were grown in pure oxygen and oxygen with up to 4% HCI. For process time in the 1 to 120 s, oxide films thicknesses in the 2 to 36 nm are obtained with a uniformity of ±2% across 100 mm wafers. These oxides show an interface density of states of 5×109 eV−1cm−2 after a 30 s post-oxidation anneal in nitrogen ambient at 1050 C.
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References
2.
Nulman, J., Scarpulla, J., Mele, T.C., Krusius, J.P., IEEE Int. Elec. Dev. Meet. Technical Digest, 1985.Google Scholar
3.
Weinberg, Z.A., Nguyen, T.N., Cohen, S.A., Kalish, R., Rapid Thermal Processing, edited by Sedwick, T.O., Seidel, T.E. and Tsaur, B.Y. (Material Research Society, Pittsburg, 1986), pp. 327–332.Google Scholar
4. Auto EL-IV, Rudolph Research, Flanders, N.J.Google Scholar
5.
Maury, A., Kim, S.C., Manocha, A., Oh, K.H., Kostelnick, D., Shive, S., IEEE Int. Elec. Dev. Meet. Technical Digest, 1986.Google Scholar
8.
Nulman, J., in Silicon Nitride and Silicon Dioxide Thin Insulating Films, edited by Kapoor, V.J. (The Electrochem. Soc, Inc.,
Pennington, NJ, 1987) in press.Google Scholar
10.
Hashimoto, C., Muramoto, S., Shiono, N., Nakajima, O., J. Electrochem. Soc., 127
129 (1980).CrossRefGoogle Scholar
11. TCA is a trade mark of the J.C. Schumacher Co., Oceanside, CA.Google Scholar
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