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Rapid Annealing of GaAs and Related Compounds

Published online by Cambridge University Press:  25 February 2011

J.S. Williams
Affiliation:
Microelectronics Technology Centre, Royal Melbourne Institute of Technology, Melbourne 3000 Australia.
S.J. Pearton
Affiliation:
Microelectronics Technology Centre, Royal Melbourne Institute of Technology, Melbourne 3000 Australia.
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Abstract

In recent years, rapid annealing of GaAs has been employed to activate ion implanted dopants and to produce metal-semiconductor contacts. More recently, rapid heating techniques have been used to anneal heterostructures without degrading requisite high mobilities of SDHT devices. This paper reviews the various annealing regimes which are useful for heat treating GaAs and related compounds. Examples are chosen which illustrate unique and potentially useful features of rapid annealing.

Type
Research Article
Copyright
Copyright © Materials Research Society 1985

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References

REFERENCES

1 Donnelly, J.P., 33, 167 (1977)Google Scholar
2 Eisen, F.H., in “Ion Beam Modification of Materials”, Guylai, J., Lohner, T. and Paztor, E., eds. (Hung. Acad. Sci. Budapest 1978) p. 147.Google Scholar
3 Stephens, K.G., Nucl. Instr. Meth. 209/210, (1983).Google Scholar
4 Eisen, F.H., in “Laser and Electron Beam Processing of MaterialsWhite, C.W. and Peercy, P.S., eds (Acadmeic Press, New York, 1980) p. 309 Google Scholar
5 Williams, J.S. and Harrison, H.B., Proc. Mat. Res. Soc. 1, 209 (1981)Google Scholar
6 Anderson, C.L., Proc. Mat. Res. Soc. 4, 653 (1982)Google Scholar
7 Williams, J.S., Proc. Mat. REs. Soc. 13, 621 (1983)Google Scholar
8 Fan, J.C.C., Proc. Mat. Res. Soc. 1, 261 (1981)Google Scholar
9 Williams, J.S., ch. 11 in “Laser Processing of Semiconductors”, Poate, J.M. and Mayer, J.W., eds. (Academic Press, New York 1982) p. 383.Google Scholar
10 Eisen, F.H., Ch. 10. in “Ion Implantation and Beam Processing”, Williams, J.S. and Poate, J.M., eds. (Academic Press, Sydney, 1984).Google Scholar
11 Sealy, B.J., Microelect. Journal 13, 21 (1982).Google Scholar
12 Lownes, B.H. in “Pulsed Laser Processing of Semiconductors”, Wood, R.F., White, C.W. and Young, R.T., eds (Academic Press, New York, 1985).Google Scholar
13 Golovchencko, J.A., and Venkatesan, T.N.C., Appl. Phys. Lett. 32., 464 (1978).Google Scholar
14 Barnes, P.A., Leamy, H.J., Poate, J.M., Ferris, S.D., Williams, J.S. and Celler, G.K. Appl. Phys. Lett. 33, 965 (1978)Google Scholar
15 Badawi, M.H., Akintunde, J.A., Sealy, B.J., and Stephens, K.G., Electron. Lett. 15, 447 (1979).Google Scholar
16 Tandon, J.L. and Eisen, F.H., in “Laser - Solid Interactions and Laser Processing”, Ferris, S.D. et al. , eds. (AIP, New York, 1979) p. 616.Google Scholar
17 Anderson, C.L., Dunlop, H.L., Hess, L.D., Olson, G.L., and Vaidyanathan, K.V., in “Laser and Electron Beam Processing of Materials”, White, C.W. and Peercy, P.S., eds. (Academic Press, New York, 1980) p. 334.Google Scholar
18 Campisano, S.U., Foti, G., Rimini, E., Eisen, F.H., Tseng, W.F., Nicolet, M.A., and Tandon, J.L., J. Appl. Phys. 51, 295 (1980).Google Scholar
19 Fan, J.C.C., Chapman, R.L., Donnelly, J.P., Turner, G.W., and Bolzer, C., App. Phys. Lett. 34, 780 (1979)Google Scholar
20 Shah, N.J., Ahmed, H., Leigh, P.A., Appl. Phys. Lett. 39, 322 (1981).Google Scholar
21 Olson, G.L., Anderson, C.L., Ness, L.D., Dunlap, H.L., McFarlene, R.A. and Vaidyanathan, K.V., in “Laser and Electron Beam Processing of Electronic Materials”, Anderson, C.L., Celler, G.K. and Rozgonyi, G.A., eds. (ECS Princeton, 1980) p. 467.Google Scholar
22 Nissim, Y.I. and Gibbons, J.F., Proc. Mat. Res. Soc. 1, 275 (1981)Google Scholar
23 Eckhardt, G. in “Laser and Electron Beam Processing of Materials”, White, C.W. and Peercy, P.S., eds. (Academic Press, New York, 1980) p. 467.Google Scholar
24 Sealy, B.J. and Surridge, R.K., IBMM-78, Guylai, J. et at, Eds. (Budapest 1979) p. 487.Google Scholar
25 Chapman, R.L., Fan, J.C.C., Donnelly, J.P., Tsaur, B.Y., Appl. Phys. Lett. 40, 805 (1982).Google Scholar
26 Harrison, H.B., Adams, F.M., Cornish, B., Johnson, S.T., Short, K.T. and Williams, J.S., Proc. Mat. Res. Soc. 13, 641 (1983).Google Scholar
27 Arai, M., Nishiyama, K. and Watanabe, N., Jap. J. Appl. Phys. 20, L124 (1981).Google Scholar
28 Davies, D.E., McNally, P.J., Ryan, T.G., Soda, K.J., and Comer, J.J., , 619 (1983).Google Scholar
29 Gat, A., IEEE Elect. Dev. Lett. 2, 85 (1981).Google Scholar
30 Sinha, A.K. and Poate, J.M., Ch 11 in “Thin Films - Inter - diffusion and Reactions”, Poate, J.M. et al. , eds. (John Wiley, New York 1978) p. 407.Google Scholar
31 Fletcher, J., Narayan, J. and Lownes, D.H., Proc. Mat. Res. Soc. 2, 421 (1981).Google Scholar
32 Rose, A., Pollock, J.T.A., Scott, M.D., Adams, F.M., Williams, J.S. and Lawson, E.M., Proc. Mat. Res. Soc. 13, 633 (1983).Google Scholar
33 Pospieszczyk, A. and Abdel Harith, M., J.Appl. Phys. 54, (6) (1983)Google Scholar
34 Boerma, D.O., Hasper, H., and Prasard, K.G. Phys. Lett. 92A, 253 (1983).Google Scholar
35 Lowndes, D.H. and Wood, R.F. Appl. Phys. Lett. 38, 971 (1980)Google Scholar
36 Auston, D.H., Golovchenko, J.A., Simons, A.L., Slusher, R.E., Smith, P.R., Surko, C.M. and Venkatesan, T.N.C., 50, 11 (1979)Google Scholar
37 Liu, S.G., Wu, CP. and Magee, C.W., 50, 603 (1979).Google Scholar
38 Gamo, K., Yuba, Y., Onaby, A.H., Murakami, K., Namba, S., and Kawasaki, Y., in "Laser and Electron Beam Processing of Materials", White, C. and Peercy, P.S., eds. (Academic Press, N.Y. 1980) p. 322.Google Scholar
39 Davies, D.E., Ryan, T.G. and Lorenzo, J.P., Appl. kPhys. Lett. 37, 612 (1980).Google Scholar
40 Pianetta, P.A., Stolte, C.A., and Hanson, J.L., ibid, p. 328.Google Scholar
41 Barnes, P.A., Leamy, H.J., Poate, J.M., D, S.. Ferris, Williams, J.S., and Celler, G.K., 50, 647 (1979).Google Scholar
42 Sealy, B.J., Kular, S.S., Badawi, M.H. and Stephens, K.G., ibid p. 610.Google Scholar
43 Harrison, H.B. and Williams, J.S., in "Laser and Electron Beam Processing of Materials", White, C.W. and Peercy, P.S., eds. (Academic Press, N.Y., 1980) p. 481.Google Scholar
44 Wood, R.F., Lowndes, D.H., and Christie, W.H., Proc. Mat. Res. Soc. 1, 231, (1981).Google Scholar
45 Cullis, A.G., these proceedings.Google Scholar
46 Gold, R.B., Powell, R.A. and Gibbons, J.F., 50, 635 (1979).Google Scholar
47 Badertscher, G., Salathe, R.R. and Luthy, W., Elect. Lett 16, 113 (1980).Google Scholar
48 Kular, S.S., Sealy, B.J., Stephens, K.G., Sadana, D.K., Booker, G.R., Sol. State. Elect. 23, 831 (1980).Google Scholar
49 Picraux, S.T., Rad. Eff. 17, 261 (1973).Google Scholar
50 Kehzu, H., Kuzuhara, M. and Takyama, Y., J. Appl. Phys. 54, 4998 (1983).Google Scholar
51 Seidel, T.E., Lischner, D.J., Knoell, R.V., Maher, D.M., Pai, C.S. and Williams, J.S., this symposium.Google Scholar
52 Tiku, S.K., Delaney, J.B., Gabriel, N.S. and Yuan, H.T., this symposium.Google Scholar
53 Zuleeg, R., private communication.Google Scholar
54 Fan, J.C.C., this symposium.Google Scholar
55 Palmstrom, C., Kavanagh, K.L. and Mayer, J.W., Symposium D, this conferenceGoogle Scholar
56 Soloman, J. and Smith, S., private communicationGoogle Scholar
57 Pearton, S.J., unpublished.Google Scholar
58 Pearton, S.J., Boerma, D.O., Poate, J.M., Williams, J.S., Johnson, S.T. and Orrman-Rossiter, K.G., unpublished.Google Scholar
59 Orrmon, K.G.-Rossiter, Johnson, S.T. and Williams, J.S., Nucl. Instr. Methods (in press).Google Scholar
60 Tatsuta, S., Inata, T., Okamura, S. and Hiyamizu, Jn, S.. J. Appl. Phys. 23, L147 (1984).Google Scholar