Hostname: page-component-586b7cd67f-dlnhk Total loading time: 0 Render date: 2024-11-25T15:13:48.939Z Has data issue: false hasContentIssue false
  • English
  • Français

Radical Species Distributions in Hot-Wire Chemical Vapor Deposition Probed Via Threshold Ionization Mass Spectrometry and Direct Simulation Monte Carlo Techniques

Published online by Cambridge University Press:  17 March 2011

Jason K. Holt ,
Maribeth Swiatek ,
David G. Goodwin ,
Harry A. Atwater ,
R.P. Muller  and
W.A. Goddard III
Jason K. Holt
Affiliation:
Thomas J. Watson Laboratories of Applied Physics California Institute of Technology Pasadena, CA 91125, U.S.A
Maribeth Swiatek
Affiliation:
Thomas J. Watson Laboratories of Applied Physics California Institute of Technology Pasadena, CA 91125, U.S.A
David G. Goodwin
Affiliation:
Thomas J. Watson Laboratories of Applied Physics California Institute of Technology Pasadena, CA 91125, U.S.A
Harry A. Atwater
Affiliation:
Thomas J. Watson Laboratories of Applied Physics California Institute of Technology Pasadena, CA 91125, U.S.A
R.P. Muller
Affiliation:
Materials and Process Simulation Center California Institute of Technology Pasadena, CA 91125, U.S.A
W.A. Goddard III
Affiliation:
Materials and Process Simulation Center California Institute of Technology Pasadena, CA 91125, U.S.A
Get access

Abstract

Monte Carlo simulations of hot-wire chemical vapor deposition (HWCVD) gas ambients indicate different flux ratios (SiH3/Si and H/SiHx) under conditions for amorphous or polycrystalline silicon growth. Gas-phase reactions of Si with ambient SiH4 studied using abinitio methods reveals that collisional stabilization of the adduct (H3SiSiH) is unlikely under typical HWCVD growth pressures, but an energetically favorable, low-pressure pathway has been identified that leads to the formation of Si2H2 and H2. Threshold ionization mass spectrometry has revealed significant quantities of the radical SiH2 at HWCVD growth pressures, indicative of heterogeneous pyrolysis. Mass spectrometry at low pressures suggests that incident silane dissociatively adsorbs at the wire and undergoes sequential H elimination to produce subhydrides. Disilicon species were not detected in significant quantities at HWCVD growth pressures. Finally, hot wire operation in a pure H2 ambient yields SiH4 as the dominant etching product from the silicon-coated walls of the growth chamber.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 664: Symposium A – Amorphous and Heterogeneous Silicon-Based Films-2001 , 2001 , A3.2
Copyright
Copyright © Materials Research Society 2001

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCE

1. Muller, R. P., Goddard, W. A. III, Holt, J. K., and Goodwin, D. G., Mat. Res. Soc. Symp. Proc. 609 (2000) A6.2.Google Scholar
2. Mokrushin, V., Bedanov, V., Tsang, W., Zacariah, M., Knyazev, V., ChemRate v1.10, National Institute of Standards and Technology, Gaithersburg, Maryland, 1999.Google Scholar
3. Bird, G. A., Molecular Gas Dynamics and the Direct Simulation of Gas Flows, Oxford University Press, 1994.Google Scholar
4. Bird, G.A., DS2V version 1.1e, http://gab.com.au/DS2V.htmlGoogle Scholar
5. Doyle, J., Robertson, R., Lin, G. H., He, M., and Gallagher, A., J. Appl. Phys. 64 (1988) 3215.10.1063/1.341539Google Scholar
6. Goodwin, D., Mat. Res. Soc. Symp. Proc. 557 (1999) 79.Google Scholar
7. Holt, J. K., Swiatek, M., Muller, R.P., Goodwin, D.G., Goddard, W.A. III, and Atwater, Harry A. Thin Solid Films [in press].Google Scholar
8. Woiki, D., Catoire, L., and Roth, P., AIChE Journal 43 (1997) 2670.Google Scholar
9. Schropp, R., Feenstra, K., Molenbroek, E., Meiling, H., and Rath, J., Philosoph. Mag. B 76 (1997) 309.Google Scholar
10. Wanka, H. and Schubert, M., Mat. Res. Soc. Symp. Proc. 467, 1997.10.1557/PROC-467-651Google Scholar
11. Ichikawa, M., Tsushima, T., Yamada, A., and Konagai, M., Jpn. J. Appl. Phys. 39 (2000) 4712.Google Scholar
12. Inoue, K., Tange, S., Tonokura, K., and Koshi, M., Abstracts of the 1st Intl. Conf. On Cat-CVD (Hot-Wire CVD) Process, Kanazawa, Japan (2000).Google Scholar
13. Wang, Y. F. and Pollard, R., J. Electrochem. Soc. 142 (1995) 1712.10.1149/1.2048645Google Scholar