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Pyrolytic Laser Direct Writing of Nickel Over Polyimides

Published online by Cambridge University Press:  28 February 2011

S. J. Bezuk ,
R. J. Baseman ,
C. Kryzak ,
K. Warner  and
G. Thomes
S. J. Bezuk
Affiliation:
UNISYS Corp., Semiconductor Operations, St. Paul, MN 55121
R. J. Baseman
Affiliation:
UNISYS Corp., Semiconductor Operations, St. Paul, MN 55121
C. Kryzak
Affiliation:
UNISYS Corp., Semiconductor Operations, St. Paul, MN 55121
K. Warner
Affiliation:
UNISYS Corp., Semiconductor Operations, St. Paul, MN 55121
G. Thomes
Affiliation:
UNISYS Corp., Semiconductor Operations, St. Paul, MN 55121
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Abstract

Polyimides are of great interest as insulators for microelectronic fabrication due to their low dielectric constant and planarizing properties. However, they are thermally sensitive films. Nonetheless, preliminary results clearly demonstrate that nickel lines readily can be laser-pyrolytically drawn over polyimide films.

While elevated laser power will damage underlying polyimide films, microelectronic quality nickel lines can be drawn using nickel carbonyl at relatively low laser intensities over polyimides with little or no change in the electrical characteristics. Polyimide's lower thermal conductivity relative to silicon dioxide facilitates increased nickel deposition rates. Self-limiting effects have been observed during the deposition that can lead to near microelectronically ideal line cross sections.

Type
Articles
Information
MRS Online Proceedings Library (OPL) , Volume 75: Symposium B – Photon, Beam, and Plasma Stimulated Chemical Processes at Surfaces , 1986 , 75
Copyright
Copyright © Materials Research Society 1987

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References

1. Osgood, R.M. Jr., Ann. Rev. Phys. Chem. 34, 77 (1983).Google Scholar
2. Ehrlich, D.J. and Tsao, J.Y., VLSI Electronics: Microstructure Science, Vol.7 (Academic Press, Inc., New York, 1983), p. 129.Google Scholar
3. Ehrlich, D.J. and Tsao, J.Y., J. Vac. Sci. Technol. B1(4), 969 (1983).Google Scholar
4. Herman, Irving P., Laser Processing and Diagnostics, (Springer-Verlag, New York, 1984), p. 396.CrossRefGoogle Scholar
5. Ehrlich, D.J. and Tsao, J.Y., Laser Processing and Diagnostics, (Springer-Verlag, New York, 1984), p. 386.CrossRefGoogle Scholar
6. Samuelson, G. and Lytle, S., in First Technical Conference on Polyimides: Synthesis Characterization and Application, (Society of Plastics Engineers, Inc., Ellenville, NY 1981) p. 10.Google Scholar
7. Senturia, S. D., Miller, R. A., Denton, D. D., Smith, F. W., and Neuhaus, H. J., Second Technical Conference on Polyimide and VLSI: A Research perspective, (Society of Plastics Engineers, Inc., Ellenville, NY, 1981), p. 107.Google Scholar
8. Bauerle, Dieter, Laser Processing and Diagnostics, (Springer-Verlag, New York, 1984), p. 166.Google Scholar
9. Krauter, W., Bauerle, D., and Fimberger, F., Appl. Phys. A31, 13 (1983).Google Scholar
10. Klaus Piglmayer, Josef Doppelbauer and Dieter Bauerle, Materials Research Society Symposia Proceedings, Vol.29, (Elsevier Science, Inc., 1984), p. 47Google Scholar
11. Dieter Bauerle, Materials Research Society Symposia Proceedings, Vol.17, (Elsevier Science, Inc., 1983), p. 19.Google Scholar
12. Herman, Irving P., Hyde, Roderick A., McWilliams, Bruce M., Weisberg, Andrew H. and Wood, Lowell L., Materials Research Society Symposia Proceedings, Vol.17, (Elsevier Science, Inc., 1983), p. 9.Google Scholar
13. Ehrlich, D.J. and Tsao, J.Y., Materials Research Society Symposia Proceedings, Vol.17, (Elsevier Science, Inc., 1983), p. 3.Google Scholar