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Protective Coating of Integrated Circuits for Operation in Corrosive Environments

Published online by Cambridge University Press:  21 February 2011

E.J. Charlson ,
R. Sabeti ,
E. M. Charlson  and
H. K. Yasuda
E.J. Charlson
Affiliation:
College of Engineering, University of Missouri, Columbia, MO 65211
R. Sabeti
Affiliation:
College of Engineering, University of Missouri, Columbia, MO 65211
E. M. Charlson
Affiliation:
College of Engineering, University of Missouri, Columbia, MO 65211
H. K. Yasuda
Affiliation:
College of Engineering, University of Missouri, Columbia, MO 65211
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Abstract

This paper describes the development of a technique for protecting non-hermetically packaged integrated circuits for use inside the human body. A two layer combination consisting of a thin adhesion-promoting primer of plasma polymerized methane covered with a thicker layer of Parylene®-C has been found to provide excellent protection during long term exposure to simulated body fluids under continuous DC bias. The process for synthesizing the two layer combination in continuous vacuum is described. Results from adhesion and electrical testing of passive test structures are given. A new technique for the formation of small openings in thick polymer coatings for neural stimulation and sensing sites of implantable sensors is described. The technique uses biased thin film resistors formed on the passivation layer to provide localized heated areas which prevent polymer deposition during synthesis.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 154: Symposium K – Electronic Packaging Materials Science IV , 1989 , 91
Copyright
Copyright © Materials Research Society 1989

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References

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