Hostname: page-component-586b7cd67f-2brh9 Total loading time: 0 Render date: 2024-11-25T15:18:15.106Z Has data issue: false hasContentIssue false

Properties of Zr-Substituted (Ba,Sr)TiO3 Thin Films for Integrated Capacitors

Published online by Cambridge University Press:  10 February 2011

G. T. Stauf
Affiliation:
Advanced Technology Materials, 7 Commerce Dr., Danbury, CT 06810, [email protected]
P. S. Chen
Affiliation:
Advanced Technology Materials, 7 Commerce Dr., Danbury, CT 06810, [email protected]
W. Paw
Affiliation:
Advanced Technology Materials, 7 Commerce Dr., Danbury, CT 06810, [email protected]
J. F. Roeder
Affiliation:
Advanced Technology Materials, 7 Commerce Dr., Danbury, CT 06810, [email protected]
T. Ayguavives
Affiliation:
North Carolina State University Department of Materials Science and Engineering, Raleigh, NC 27695
J.-P. Maria
Affiliation:
North Carolina State University Department of Materials Science and Engineering, Raleigh, NC 27695
A. I. Kingon
Affiliation:
North Carolina State University Department of Materials Science and Engineering, Raleigh, NC 27695
Get access

Abstract

There has been significant interest recently in use of BaSrTiO3 (BST) thin films for integrated capacitors; these devices have benefits for high frequency operations, particularly when high levels of charge or energy storage are required. We discuss the electrical properties of BST thin films grown by metalorganic chemical vapor deposition (MOCVD) which make them suitable for these applications, as well as the impact of processing conditions such as growth temperature on specific film properties. We have also examined addition of Zr in amounts ranging up to 20% to the BST films. X-Ray diffraction indicates that the Zr is incorporated into the BST lattice. Voltage withstanding capability, leakage and dielectric constant of the thin films have been measured as functions of deposition temperature and Zr content. Addition of Zr to BST films increases breakdown voltages by as much as a factor of two, to approximately 2 MV/cm, raising their energy storage density values to levels approaching 30 J/cc. Charge storage densities of above 60 fF/µm2were also obtained.

Type
Research Article
Copyright
Copyright © Materials Research Society 2000

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1.Dielectric Properties, Leakage Behaviour, and Resistance Degradation of Thin Films of the Solid Solution Series Ba(Ti1−y Zr y )O3 ”, Hoffmann, S. and Waser, R. M., Integrated Ferroelectrics 17, p. 141 (1997).10.1080/10584589708012989Google Scholar
2. “Nuclear Magnetic Resonance and Infrared Spectral Studies on Labile cis-Dialkoxybis(acetylacetonato) titanium(IV) Compounds.”, Bradley, D.C. and Holloway, C.E., J. Chem. Soc. (A), p. 282 (1969).10.1039/j19690000282Google Scholar
3. “Advances in Precursor Development for CVD of Barium-Containing Materials," Vaartstra, B.A., Gardiner, R.A., Gordon, D.C., Ostrander, R.L. and Rheingold, A.L.. Presented at the Fall MRS Meeting, Boston, 1993.Google Scholar
4.MOCVD of BaSrTiO3 for ULSI DRAMs”, Kirlin, P., Bilodeau, S., Buskirk, P. Van, Integrated Ferroelectrics 7(2), p. 307 (1995).10.1080/10584589508220241Google Scholar