Hostname: page-component-cd9895bd7-gbm5v Total loading time: 0 Render date: 2024-12-27T01:33:48.921Z Has data issue: false hasContentIssue false
  • English
  • Français

Properties of P(VDF-TeFE) thin film formed by annealing process with electric field

Published online by Cambridge University Press:  31 January 2011

Jong-Hyeon Jeong ,
Chiharu Kimura ,
Hidemitsu Aoki ,
Masanori Okuyama  and
Takashi Sugino
Jong-Hyeon Jeong
Affiliation:
[email protected], Osaka university, Graduate School of Egineering, Suita-shi, Japan
Chiharu Kimura
Affiliation:
[email protected], Osaka university, Graduate School of Egineering, Suita-shi, Osaka-fu, Japan
Hidemitsu Aoki
Affiliation:
[email protected], Osaka university, Graduate School of Egineering, Suita-shi, Osaka-fu, Japan
Masanori Okuyama
Affiliation:
[email protected], Osaka University, Graduate School of Engineering Science, Toyonaka-shi, Osaka-fu, Japan
Takashi Sugino
Affiliation:
[email protected], Osaka university, Graduate School of Egineering, Suita-shi, Osaka-fu, Japan
Get access

Abstract

In order to apply P(VDF-TeFE) piezoelectric polymer to micro-generator as a membrane, the polymer is deposited on a substrate by spin-coating method. In this process, some changes of properties and quality of the film are caused by a solvent which was used to dissolve the polymer granule. Since a solvent affects the film properties and surface stability, we have carried out the thermal process at a temperature higher than melting point. However, this thermal process due to a temperature higher than Curie point of the polymer causes a falling-off in electrical properties. In this paper, we have studied a method to prevent a falling-off in electric properties of P(VDF-TeFE) film even though the film is annealed at a temperature higher than Curie point.

Keywords

piezoelectricpolymersol-gel
Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 1218: Symposium Z – Energy Harvesting–From Fundamentals to Devices , 2009 , 1218-Z05-20
Copyright
Copyright © Materials Research Society 2010

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

1 Williams, C.B. Shearwood, C. Harradine, M. A. Mellor, P. H. Birch, T. S. and Yates, R. B. IEEE proc. Circuits Devices and Systems, vol. 148, no. 6, pp. 337–342 (2001).Google Scholar
2 Amirtharajah, R. and Chandrakasan, A.P. IEEE J. Solid-State Circuits, vol. 33, no. 5, pp. 687–695 (1998).Google Scholar
3 Roundy, S.J. Doctoral dissertation, Dept. of Mechanical Eng., Univ. of California, Berkeley (2003).Google Scholar
4 Schenck, N.S. and Paradiso, J.A. IEEE Micro, vol. 21, no. 3, pp. 30–42 (2001).Google Scholar
5 Kawai, H. Japanese Journal of Applied Physics, vol. 8, pp. 975–976 (1969).Google Scholar
6 Zheng, J.P. IEEE 6th international Conference on Properties and Applications of Dielectric Materials (2000).Google Scholar
7 Wen, J. X. Polymer Journal, vol. 17, no. 2, pp. 399–407 (1985).Google Scholar
8 Olcum, S. et al., IEEE Transactions on Ultrasonic, Ferroelectric, and Frequency Control, vol. 52, no. 12 (2005).Google Scholar
9 Jeong, J.H. Kimura, C. Aoki, H. Okuyama, M., and Sugino, T. to be published in ECS Trans. 19 (2009)Google Scholar
10 Dementjev, A.P. and Maslakov, K.I. Appl. Surf. Sci. 253, pp. 1095 (2006).Google Scholar
11 Schindler, M. Hawthorne, F.C. Freund, M.S. and Burns, P.C. Geochim. Cosmochim. Acta 73, pp. 2488 (2009).Google Scholar
12 Deng, J. Zhang, L. Dai, H. He, H. and Au, C.T. Catal. Lett. 123, pp. 294 (2008).Google Scholar
13 Mihaly, J. Sterkel, S. Ortner, H. M. Kocsis, L. Hajba, L. Furdyga, E. and Mink, J. Croat. Chem. Acta 79, pp. 497 (2006).Google Scholar
14 Chlopek, J. Morawska-Chochol, A., and Paluszkiewicz, C. J. Mol. Struct. 875, pp. 101 (2008).Google Scholar
15 Lanceros-Mendez, S., Mano, J.F. Costa, A.M. and Schmidt, V.H. J. Macromol. Sci. B40, pp. 517 (2001).Google Scholar