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Properties of Image Sensor Structure Obtained Below 120°C On The Foil By Reactive Magnetron Sputtering

Published online by Cambridge University Press:  10 February 2011

A. Kolodziej ,
P. Krewniak  and
R. Tadeusiewicz
A. Kolodziej
Affiliation:
Department of Electronics, University of Mining and Metallurgy, al.Mickiewicza 30, 30-059 Krakow, Poland, [email protected]
P. Krewniak
Affiliation:
Department of Electronics, University of Mining and Metallurgy, al.Mickiewicza 30, 30-059 Krakow, Poland
R. Tadeusiewicz
Affiliation:
Department of Electronics, University of Mining and Metallurgy, al.Mickiewicza 30, 30-059 Krakow, Poland
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Abstract

Polyimide substrates are of interest because of their thermal stability, light weight, and good mechanical characteristics. This paper reports thermal control multilayer deposition experiments which have strongly affected the properties of the image sensor structure (TFT + photodiode). Particularly TFT properties have been studied with respect to difficulties of obtaining of good quality a-SiNx:H films at temperature below 120°C. We characterize the structural properties using infrared absorption, refractive index measurements, small angle x-ray diffraction and the optoelectrical measurements of the TFT and PIN diode structure. The linear image sensor consisting of two rows, 40 pixels per row, with dimensions 0.6 mm2was made on the polyimide foil.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 558: Symposium B – Flat-Panel Displays and Sensors-Principles, Materials… , 1999 , 243
Copyright
Copyright © Materials Research Society 2000

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References

REFERENCES

1. Nath, P., Vogeli, C., Hoffman, K., Laarman, T., Solar Energy Materials, 23, 1991, pp. 297–302.Google Scholar
2. Shinohara, H., Abe, M., Nishi, K., Arai, Y., Ist IEEE WCPEC, 1994, pp.682-685Google Scholar
3. Kang, Y.S., Esho, P., Knipe, R., Tregilgas, J., Mat. Res. Soc. Symp., 436, 1997, pp. 35–40.Google Scholar
4. Huang, J.R., Lee, Y., Toporow, C.M.C., Vendura, G.J., Jackson, T.N., Wronski, C.R., Proc. of 261h IEEE PVSC, September 1997.Google Scholar
5. Harris, F.W., in: Wilson, D., Stenzenberger, H.D., Hergenrother, P.M. (Eds.), Polyimides, Blackie and Son, New York, 1990.Google Scholar
6. McCormick, C.S., Weber, C.E., Abelson, J.R., Davis, G.A., Weiss, R.E., Aebi, V., J. Vac. Sci. Technol. A 15 (5), 1997.Google Scholar
7. Kolodziej, A., Nowak, S., Krewniak, P., Mat. Res. Soc. Symp. Proc. 452, 913 (1997).Google Scholar
8. Kolodziej, A., J. Non-Cryst. Solids 185, 168 (1995).Google Scholar
9. Langford, A.A., Fleet, M.L., Nelson, B.P., Langford, W.A., Maley, N., Phys. Rev. B 45, 13 367 (1992).Google Scholar
10. Weisfield, R.L., Street, R.A., Apte, R.B., Moore, A., The Physics of Medical Imaging, Proc. SPIE, 3032, 14, 1997.Google Scholar
11. Street, R.A., Wu, X.D., Weisfield, R., Ready, S., Apte, R., Ngyuen, M., Jackson, W.B., Nylen, P., J. Non-Cryst. Solids 198–200 (1996) 1151–1154.Google Scholar