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Processing of Novel Electroceramic Components by SFF Techniques

Published online by Cambridge University Press:  10 February 2011

A. Safari ,
S. C. Danforth ,
A. L. Kholkin ,
I. A. Cornejo ,
F. Mohammadi ,
T. McNulty  and
R. Panda
A. Safari
Affiliation:
Department of Ceramic and Materials Engineering, Rutgers University, The State University of New Jersey, 607 Taylor Rd., Piscataway, NJ 08854-8065
S. C. Danforth
Affiliation:
Department of Ceramic and Materials Engineering, Rutgers University, The State University of New Jersey, 607 Taylor Rd., Piscataway, NJ 08854-8065
A. L. Kholkin
Affiliation:
Department of Ceramic and Materials Engineering, Rutgers University, The State University of New Jersey, 607 Taylor Rd., Piscataway, NJ 08854-8065
I. A. Cornejo
Affiliation:
Department of Ceramic and Materials Engineering, Rutgers University, The State University of New Jersey, 607 Taylor Rd., Piscataway, NJ 08854-8065
F. Mohammadi
Affiliation:
Department of Ceramic and Materials Engineering, Rutgers University, The State University of New Jersey, 607 Taylor Rd., Piscataway, NJ 08854-8065
T. McNulty
Affiliation:
Department of Ceramic and Materials Engineering, Rutgers University, The State University of New Jersey, 607 Taylor Rd., Piscataway, NJ 08854-8065
R. Panda
Affiliation:
Department of Ceramic and Materials Engineering, Rutgers University, The State University of New Jersey, 607 Taylor Rd., Piscataway, NJ 08854-8065
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Abstract

Novel piezoelectric ceramic and ceramic/polymer composite structures were fabricated by solid freeform fabrication (SFF) for sensor and actuator applications. SFF techniques including fused deposition of ceramics (FDC) and Sanders prototyping (SP) were utilized to fabricate a variety of complex structures directly from a computer aided design (CAD) file. Novel composite structures including volume fraction gradients (VFG) and staggered rods, as well as actuator designs such as tubes, spirals and telescopes were made using the flexibility provided by the above processes. VFG composites were made by SP technique with the ceramic content decreasing from the center towards the edges. This resulted in a reduction of side lobe intensity in the acoustic beam pattern. The FDC technique was used to manufacture high authority actuators utilizing novel designs for the amplification of strain under applied electric field. The design, fabrication and electromechanical properties of these composite and actuator structures are discussed in this paper.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 542: Symposium V – Solid Freeform and Additive Fabrication , 1998 , 85
Copyright
Copyright © Materials Research Society 1999

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References

1. Gururaja, T. R., Safari, A., Newnham, R.,, and Cross, L. E., in ”Electronic Ceramics”, ed. by Levinson, L. M., NY: Marcel Dekker, p. 93 (1987).Google Scholar
2. Safari, A., J Phys. III (France) 4, p. 1129 (1994).Google Scholar
3. Janas, V. F. and Safari, A., J. Am. Ceram. Soc. 78, p. 2945 (1995).Google Scholar
4. Marcus, H. L. and Bourell, D. L., Advanced Materials & Processing 9, p. 28 (1993).Google Scholar
5. Rapid Prototyping Report 7, p. 3 (1997).Google Scholar
6. Danforth, S. C., Safari, A., Jafari, M., and Langrana, N., Journal of Naval Review (in press, Aug. 1998).Google Scholar
7. Danforth, S. C., Agarwala, M., Bandyopadhyay, A., Langrana, N., Jamalabad, V. R., Safari, A., Weeren, R. van, US Patent No. 5,738,817.Google Scholar
8. Murray, V., Hayward, G., and Hossack, J., Proceedings of the IEEE Ultrasonic Symposium, p. 767 (1989).Google Scholar
9. Panda, R. K., Kholkin, A., Danforth, S. C. and Safari, A., submitted to J. Mater. Sci.: Mater. in Electronics.Google Scholar
10. Hossack, J. A., and Hayward, G., IEEE Ultrasonics Symposium, p. 389 (1990).Google Scholar
11. Bandyopadhyay, A., Panda, R. K., McNulty, T. F., Mohammadi, F., Danforth, S. C., and Safari, A., Rapid Prototyping Journal 4, p. 37 (1998).Google Scholar
12. Zhang, Q. M., Wang, H., and Cross, L. E., in Proc. SPIE, Smart Structures and Materials, 1916, p. 244 (1993).Google Scholar