Hostname: page-component-78c5997874-t5tsf Total loading time: 0 Render date: 2024-11-20T01:31:51.619Z Has data issue: false hasContentIssue false

Processing, Microstructure, and Thermal Expansion Measurements for High Temperature Ru-Al-Cr B2 Alloys

Published online by Cambridge University Press:  01 February 2011

Yutaka Hashimoto
Affiliation:
[email protected], Kyoto University, Materials Science and Engineering, Kyoto, Sakyo-ku, Japan
Norihiko L. Okamoto
Affiliation:
[email protected], Kyoto University, Materials Science and Engineering, Kyoto, Sakyo-ku, Japan
Manuel Acosta
Affiliation:
[email protected], Purdue University, Materials Engineering, United States
David R Johnson
Affiliation:
[email protected], Purdue University, Materials Engineering, United States
Haruyuki Inui
Affiliation:
[email protected], Kyoto University, Materials Science and Engineering, Kyoto, Sakyo-ku, Japan
Get access

Abstract

The B2 intermetallic compound RuAl has a melting temperature above 2000 °C and is a candidate for high temperature structural applications. A large extension of the B2 phase field is found in the Ru-Al-Cr system as was documented by the characterization of arc-melted and heat treated alloys. Two compositions consisting of Ru-35Al-19Cr and Ru-20Al-38Cr (at. %) were directionally solidified in an optical floating zone furnace. Depending upon the processing conditions, single phase, polycrystalline, B2 microstructures could be produced. The coefficient of thermal expansion (CTE) was measured from room temperature to 1250 °C for the Ru-20Al-38Cr alloy, and an average value of 11×10-6 K-1 was found. Additionally, the thermal conductivity was measured as 27 W/mK at room temperature for the Ru-20Al-38Cr B2 alloy and as 89 W/mK for binary RuAl.

Type
Research Article
Copyright
Copyright © Materials Research Society 2009

Access options

Get access to the full version of this content by using one of the access options below. (Log in options will check for institutional or personal access. Content may require purchase if you do not have access.)

References

REFERENCES

[1]. Fleischer, R.L., Zabala, R. J., Met Trans. A 21A, 2709 (1990).Google Scholar
[2]. Wolff, I.M., Sauthoff, G., Acta Mater. 45, 2949 (1997).Google Scholar
[3]. Lu, D.C., Pollock, T. M., Acta Mater. 47, 1035 (1999).Google Scholar
[4]. Mücklich, F. and IIić, N., Intermetallics 13, 5 (2005).Google Scholar
[5]. Reynolds, T.D. and Johnson, D.R., Mater. Res. Symp. Proc. 842, S6.2.1 (2005).Google Scholar
[6]. Acosta, M., MS thesis, 2008, Materials Engineering, Purdue University.Google Scholar
[7]. Fleischer, R.L. and McKee, D.W. Met. Trans. A 24A, 759 (1993).Google Scholar
[8]. Tryon, B., Pollock, T.M., Gigliotti, M.F.X. and Hemker, K., Scripta Mater. 50, 845 (2004).Google Scholar
[9]. Clark, R.W. and Whittenberger, J.D., Thermal expansion, 8. (Plenum Press, 1981) p. 189.Google Scholar
[10]. Hanai, S., Terada, Y., Ohkubo, K., Mohri, T., and Suzuki, T., Intermetallics 4, S41 (1996).Google Scholar
[11]. Anderson, S.A. and Lang, C.I., Scripta Mater. 38, 493 (1998).Google Scholar