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Predictive Design of Multicomponent Polymers for Printed Circuit Boards
Published online by Cambridge University Press: 25 February 2011
Abstract
The most common structural and dielectric materials for printed wiring boards are polymer composites such as epoxy/fiberglass and polyimide/fiberglass. The light weight, low cost, processability, and low dielectric constant of these materials make them particularly suited for this application.
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