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Power Delivery, Signaling and Cooling for 3D Integrated Systems
Published online by Cambridge University Press: 31 January 2011
Abstract
Three-dimensional (3D) integration of ICs provides unique opportunities to improve bandwidth, latency, and power dissipation bottlenecks of interconnects (both on- and off-chip). However, while 3D IC integration improves signal interconnection, it also presents new challenges, especially in power delivery and cooling (“thermal interconnects”). The focus of this paper is on some of the key challenges and promising technologies to address power delivery, cooling, and signaling in a 3D stack of logic ICs.
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- Copyright © Materials Research Society 2009