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The Potential Effect of Multilayer Patterns on Temperature Uniformity During Rapid Thermal Processing

Published online by Cambridge University Press:  15 February 2011

Jeffrey P. Hebb ,
Klavs F. Jensen  and
Erik W. Egan
Jeffrey P. Hebb
Affiliation:
Department of Mechanical Engineering, Massachusetts Institute of Technology, Cambridge,MA 02139
Klavs F. Jensen
Affiliation:
Department of Chemical Engineering, Massachusetts Institute of Technology, Cambridge, MA 02139
Erik W. Egan
Affiliation:
Semiconductor Products Sector, Advanced Custom Technologies, Motorola, Inc., Mesa, AZ 85202
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Abstract

This work aims to systematically gain an understanding of the effects of multilayer patterns on wafer temperature uniformity during rapid thermal processing, and explore possible solutions to the problem. Steady state and transient wafer temperature distributions are simulated by combining a detailed reactor transport model with multilayer electromagnetic theory to predict wafer radiative properties. A generic axisymmetric RTP system with single-side illumination is used as a testbed to explore pattern effects for a simulated source/drain implant anneal.

Type
Research Article
Information
MRS Online Proceedings Library (OPL) , Volume 387: Symposium P – Rapid Thermal and Integrated Processing IV , 1995 , 21
Copyright
Copyright © Materials Research Society 1995

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